A D-Band Multichannel TX System-in-Package Achieving 84.48 Gb/s With 64-QAM Based on 45-nm CMOS and Low-Cost PCB Technology
A high-data-rate D -band transmitter (TX) module cointegrating a dual-channel TX integrated circuit (IC) in 45-nm CMOS partially deplated silicon-on-insulator (PDSOI) technology and an antenna is presented. The proposed system-in-package is based on an innovative channel-bonding technique and is fa...
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Veröffentlicht in: | IEEE transactions on microwave theory and techniques 2022-07, Vol.70 (7), p.3385-3395 |
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Sprache: | eng |
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