A D-Band Multichannel TX System-in-Package Achieving 84.48 Gb/s With 64-QAM Based on 45-nm CMOS and Low-Cost PCB Technology

A high-data-rate D -band transmitter (TX) module cointegrating a dual-channel TX integrated circuit (IC) in 45-nm CMOS partially deplated silicon-on-insulator (PDSOI) technology and an antenna is presented. The proposed system-in-package is based on an innovative channel-bonding technique and is fa...

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Veröffentlicht in:IEEE transactions on microwave theory and techniques 2022-07, Vol.70 (7), p.3385-3395
Hauptverfasser: Hamani, Abdelaziz, Foglia Manzillo, Francesco, Siligaris, Alexandre, Cassiau, Nicolas, Blampey, Benjamin, Hameau, Frederic, Dehos, Cedric, Clemente, Antonio, Gonzalez-Jimenez, Jose Luis
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Sprache:eng
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