P‐47: A Repair Method for Improving Pad Damage of COG MiniLED

P‐47: A Repair Method for Improving Pad Damage of COG MiniLED

A COG Mini‐LED chip repair method with a yield ≥ 99.9% is realized by the following three methods: first, a buffer layer is added at the bottom of the pad; second, a suitable repair temperature; and third, IMC suppression layers are added on the surface of the pad.

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Veröffentlicht in:SID International Symposium Digest of technical papers 2022-06, Vol.53 (1), p.1226-1228
Hauptverfasser: Tang, Hai, Chu, Yutian, Kong, Chengcheng, Gao, Liang, Zhai, Ming, Sun, Haiwei
Format: Artikel
Sprache:eng
Schlagworte:
Buffer layers
chip on glass (COG)
Glass based Mini-LED
laser bonding
Repair
surface mounted devices (SMD) rework
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Beschreibung
Zusammenfassung:A COG Mini‐LED chip repair method with a yield ≥ 99.9% is realized by the following three methods: first, a buffer layer is added at the bottom of the pad; second, a suitable repair temperature; and third, IMC suppression layers are added on the surface of the pad.
ISSN:0097-966X
2168-0159
DOI:10.1002/sdtp.15726