On the prediction of the stress field in adhesive joints using a combined analytical-numerical method
In this paper, the stress field in adhesively bonded joints is predicted by employing an analytical approach together with the finite element method (FEM). To accomplish this, the adhesive joint is considered as a bi-material notch. Then, a unified analytical formulation for the in-plane stress and...
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Veröffentlicht in: | International journal of adhesion and adhesives 2022-07, Vol.116, p.103151, Article 103151 |
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Format: | Artikel |
Sprache: | eng |
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