Effect of ultrasonic compound cutting on the microstructure and properties of formed chip

Severe plastic deformation (SPD) with high strain rate can increase the material dislocation density, reduce the grain size, and improve the mechanical properties. In this article, ultrasonic compound cutting (UCC) was proposed to improve the efficiency of preparing ultra-fine grain (UFG) pure coppe...

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Veröffentlicht in:	International journal of advanced manufacturing technology 2022-06, Vol.120 (9-10), p.5763-5775
Hauptverfasser:	Sun, Haimeng, Jiao, Feng, Niu, Ying, Wang, Zhuangfei
Format:	Artikel
Sprache:	eng
Schlagworte:	CAE) and Design Computer-Aided Engineering (CAD Copper Dislocation density Engineering Grain refinement Grain size High strain rate Industrial and Production Engineering Machining Mechanical Engineering Mechanical properties Media Management Microhardness Microstructure Original Article Plastic deformation Shear zone Three dimensional models Ultrasonic vibration
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