Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-First and Die-First Fan-Out Wafer-Level Packaging (FOWLP)

A thorough evaluation on selecting a bondable laser release material for redistribution layer (RDL)-first and die-first fan-out wafer-level packaging (FOWLP) is presented in this article. Four laser release materials were identified based on their absorption coefficient at 355 nm. In addition, all f...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2022-04, Vol.12 (4), p.692-699
Hauptverfasser:	Lee, Chia-Hsin, Huang, Baron, See, Jennifer, Prenger, Luke, Lin, Yu-Min, Chiu, Wei-Lan, Lee, Ou-Hsiang, Chen, Kuan-Neng
Format:	Artikel
Sprache:	eng
Schlagworte:	Absorptivity Adhesives Die-first fan-out wafer-level packaging (FOWLP) effective ablation region Electronic packaging Evaluation Fanout FOWLP Glass glass carrier wafer Inspection Ion beams Laser ablation Laser stability Lasers Molding (process) Power lasers redistribution layer (RDL)-first FOWLP saturation region single-pulse laser ablation Test vehicles Thermal stability
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