Tailoring the internal structure of porous copper film via size-controlled copper nanosheets for electromagnetic interference shielding

•Controlling the internal structure of electromagnetic interference(EMI) shielding film is an important issue in the development of EMI shielding applications.•Cu NSs size was controlled by adjusting the concentrations of the shape modifier, stabilizer and reductant.•The larger Cu NSs formed a more...

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Veröffentlicht in:	Materials science & engineering. B, Solid-state materials for advanced technology Solid-state materials for advanced technology, 2022-04, Vol.278, p.115611, Article 115611
Hauptverfasser:	Kwang Choi, Ho, Bae, Sukang, Lee, Seoung-Ki, Hyun Lee, Sang, Lee, Kisu, Ko, Seok-Young, Kang, Jae-Wook, Yang, Si-Yeong, Kim, Tae-Wook
Format:	Artikel
Sprache:	eng
Schlagworte:	Copper Copper nanosheet Electromagnetic shielding Fillers Iodine Metal films Metal nanosheet Nanosheets Porous structure Reducing agents Thickness Two-dimensional materials
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