Damage Progression and Fragmentation in Atomistic, Single Crystal Copper at High Strain Rates

We show a correlation between nanoscale damage and fragmentation length scale through atomistic simulations. We simulated homogeneously expanding perfect, single crystal copper at rates ranging from 1E+08 to 3E+10 s-1 and temperatures from 200 to 1000 K. Damage was quantified in terms of void number...

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Veröffentlicht in:	Solid State Phenomena 2016-12, Vol.258, p.49-52
Hauptverfasser:	Dickel, Doyl E., Danielson, Kent, Williams, Neil, Hammi, Youssef, Huddleston, Bradley D., Horstemeyer, Mark F.
Format:	Artikel
Sprache:	eng
Schlagworte:	Copper Damage Density Fragmentation High strain rate Molecular dynamics Simulation Single crystals
Online-Zugang:	Volltext
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