Evaluation method for the machining accuracy of diamond wire squaring mono-crystalline silicon and its application in comparison of reciprocating wire and endless wire
Square wire sawing (squaring) is the preceding process of silicon ingot grinding and slicing for solar wafer manufacturing. The machining accuracy will affect the machining efficiency of the grinding process, and affect the quality of slicing. At present, extreme difference (ED) method is used for t...
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Veröffentlicht in: | International journal of advanced manufacturing technology 2022-05, Vol.120 (1-2), p.1053-1069 |
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Format: | Artikel |
Sprache: | eng |
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