Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints

Laser soldering has attracted attention as an alternative soldering process for micro-soldering that minimizes the side effects of the conventional reflow soldering. In this study, Sn-3.0Ag-0.5Cu (wt.%) solder, a widely used lead-free solder, was bonded on the organic solderability preservative-prep...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2022-04, Vol.33 (10), p.7983-7994
Hauptverfasser:	Lee, Dong-Hwan, Jeong, Min-Seong, Yoon, Jeong-Won
Format:	Artikel
Sprache:	eng
Schlagworte:	Aging Bonded joints Characterization and Evaluation of Materials Chemistry and Materials Science Comparative studies Copper Ductile fracture Heat treating Interface reactions Intermetallic compounds Lasers Lead free Materials Science Mechanical properties Optical and Electronic Materials Preservatives Reflow soldering Shear strength Shear tests Side effects Silver Solderability Solders Substrates Tin Tin base alloys
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