Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints
Laser soldering has attracted attention as an alternative soldering process for micro-soldering that minimizes the side effects of the conventional reflow soldering. In this study, Sn-3.0Ag-0.5Cu (wt.%) solder, a widely used lead-free solder, was bonded on the organic solderability preservative-prep...
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Veröffentlicht in: | Journal of materials science. Materials in electronics 2022-04, Vol.33 (10), p.7983-7994 |
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creator | Lee, Dong-Hwan Jeong, Min-Seong Yoon, Jeong-Won |
description | Laser soldering has attracted attention as an alternative soldering process for micro-soldering that minimizes the side effects of the conventional reflow soldering. In this study, Sn-3.0Ag-0.5Cu (wt.%) solder, a widely used lead-free solder, was bonded on the organic solderability preservative-prepared Cu substrate through laser soldering and reflow soldering, respectively. After the laser and reflow soldering processes, the intermetallic compound (IMC) layer of the joints was analyzed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. Laser soldering formed a thin and flat IMC layer in a short process time. Reflow soldering formed a relatively thick and uneven IMC layer at the interface compared to laser soldering. The different morphologies of the interfacial IMC layers formed by different soldering processes caused the IMC layer to grow differently in the isothermal aging treatment. Ball shear tests were performed to evaluate the mechanical properties of the solder joint. The shear strength of laser soldering that forms a thin IMC layer and fine microstructure was the highest immediately after soldering, but fell to a similar level of reflow-soldered samples after isothermal aging treatment. As the isothermal aging time increased, the brittle fracture area of reflow soldering increased. In the laser soldering, the ductile fracture modes are observed in the whole-aging period. |
doi_str_mv | 10.1007/s10854-022-07948-w |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2645688826</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2645688826</sourcerecordid><originalsourceid>FETCH-LOGICAL-c319t-3e372f3551039049ceb254c6ba3e8a496c4aacffc40e71455141954e0ddea72f3</originalsourceid><addsrcrecordid>eNp9kE1OwzAQhS0EEqVwAVaWWJv6N3GWVcSfVIkFILGzXGdSpUrjYCdU3XEHbshJMC0SOzYzi_nem5mH0CWj14zSfBYZ1UoSyjmheSE12R6hCVO5IFLz12M0oYXKiVScn6KzGNeU0kwKPUGx9JveBjs074DjMFY77GvcdAOE2rrGtjiAdUPjO2y7Ci99VzXdCvfB9xCGPdzaCIHsxwHq1m9J9G0FASr81H19fM5XqZTjrBzx2ifneI5OattGuPjtU_Rye_Nc3pPF491DOV8QJ1gxEAEi57VQilFRUFk4WHIlXba0ArSVReakta6unaSQM5k4yQolgVYV2B_lFF0dfNO1byPEwaz9GLq00vBMqkxrzbNE8QPlgo8xfWD60Gxs2BlGzU-45hCuSeGafbhmm0TiIIoJ7lYQ_qz_UX0D85uAnw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2645688826</pqid></control><display><type>article</type><title>Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints</title><source>SpringerNature Journals</source><creator>Lee, Dong-Hwan ; Jeong, Min-Seong ; Yoon, Jeong-Won</creator><creatorcontrib>Lee, Dong-Hwan ; Jeong, Min-Seong ; Yoon, Jeong-Won</creatorcontrib><description>Laser soldering has attracted attention as an alternative soldering process for micro-soldering that minimizes the side effects of the conventional reflow soldering. In this study, Sn-3.0Ag-0.5Cu (wt.%) solder, a widely used lead-free solder, was bonded on the organic solderability preservative-prepared Cu substrate through laser soldering and reflow soldering, respectively. After the laser and reflow soldering processes, the intermetallic compound (IMC) layer of the joints was analyzed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. Laser soldering formed a thin and flat IMC layer in a short process time. Reflow soldering formed a relatively thick and uneven IMC layer at the interface compared to laser soldering. The different morphologies of the interfacial IMC layers formed by different soldering processes caused the IMC layer to grow differently in the isothermal aging treatment. Ball shear tests were performed to evaluate the mechanical properties of the solder joint. The shear strength of laser soldering that forms a thin IMC layer and fine microstructure was the highest immediately after soldering, but fell to a similar level of reflow-soldered samples after isothermal aging treatment. As the isothermal aging time increased, the brittle fracture area of reflow soldering increased. In the laser soldering, the ductile fracture modes are observed in the whole-aging period.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1007/s10854-022-07948-w</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Aging ; Bonded joints ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Comparative studies ; Copper ; Ductile fracture ; Heat treating ; Interface reactions ; Intermetallic compounds ; Lasers ; Lead free ; Materials Science ; Mechanical properties ; Optical and Electronic Materials ; Preservatives ; Reflow soldering ; Shear strength ; Shear tests ; Side effects ; Silver ; Solderability ; Solders ; Substrates ; Tin ; Tin base alloys</subject><ispartof>Journal of materials science. Materials in electronics, 2022-04, Vol.33 (10), p.7983-7994</ispartof><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2022</rights><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2022.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-3e372f3551039049ceb254c6ba3e8a496c4aacffc40e71455141954e0ddea72f3</citedby><cites>FETCH-LOGICAL-c319t-3e372f3551039049ceb254c6ba3e8a496c4aacffc40e71455141954e0ddea72f3</cites><orcidid>0000-0001-8708-542X</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10854-022-07948-w$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10854-022-07948-w$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Lee, Dong-Hwan</creatorcontrib><creatorcontrib>Jeong, Min-Seong</creatorcontrib><creatorcontrib>Yoon, Jeong-Won</creatorcontrib><title>Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints</title><title>Journal of materials science. Materials in electronics</title><addtitle>J Mater Sci: Mater Electron</addtitle><description>Laser soldering has attracted attention as an alternative soldering process for micro-soldering that minimizes the side effects of the conventional reflow soldering. In this study, Sn-3.0Ag-0.5Cu (wt.%) solder, a widely used lead-free solder, was bonded on the organic solderability preservative-prepared Cu substrate through laser soldering and reflow soldering, respectively. After the laser and reflow soldering processes, the intermetallic compound (IMC) layer of the joints was analyzed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. Laser soldering formed a thin and flat IMC layer in a short process time. Reflow soldering formed a relatively thick and uneven IMC layer at the interface compared to laser soldering. The different morphologies of the interfacial IMC layers formed by different soldering processes caused the IMC layer to grow differently in the isothermal aging treatment. Ball shear tests were performed to evaluate the mechanical properties of the solder joint. The shear strength of laser soldering that forms a thin IMC layer and fine microstructure was the highest immediately after soldering, but fell to a similar level of reflow-soldered samples after isothermal aging treatment. As the isothermal aging time increased, the brittle fracture area of reflow soldering increased. In the laser soldering, the ductile fracture modes are observed in the whole-aging period.</description><subject>Aging</subject><subject>Bonded joints</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Comparative studies</subject><subject>Copper</subject><subject>Ductile fracture</subject><subject>Heat treating</subject><subject>Interface reactions</subject><subject>Intermetallic compounds</subject><subject>Lasers</subject><subject>Lead free</subject><subject>Materials Science</subject><subject>Mechanical properties</subject><subject>Optical and Electronic Materials</subject><subject>Preservatives</subject><subject>Reflow soldering</subject><subject>Shear strength</subject><subject>Shear tests</subject><subject>Side effects</subject><subject>Silver</subject><subject>Solderability</subject><subject>Solders</subject><subject>Substrates</subject><subject>Tin</subject><subject>Tin base alloys</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp9kE1OwzAQhS0EEqVwAVaWWJv6N3GWVcSfVIkFILGzXGdSpUrjYCdU3XEHbshJMC0SOzYzi_nem5mH0CWj14zSfBYZ1UoSyjmheSE12R6hCVO5IFLz12M0oYXKiVScn6KzGNeU0kwKPUGx9JveBjs074DjMFY77GvcdAOE2rrGtjiAdUPjO2y7Ci99VzXdCvfB9xCGPdzaCIHsxwHq1m9J9G0FASr81H19fM5XqZTjrBzx2ifneI5OattGuPjtU_Rye_Nc3pPF491DOV8QJ1gxEAEi57VQilFRUFk4WHIlXba0ArSVReakta6unaSQM5k4yQolgVYV2B_lFF0dfNO1byPEwaz9GLq00vBMqkxrzbNE8QPlgo8xfWD60Gxs2BlGzU-45hCuSeGafbhmm0TiIIoJ7lYQ_qz_UX0D85uAnw</recordid><startdate>20220401</startdate><enddate>20220401</enddate><creator>Lee, Dong-Hwan</creator><creator>Jeong, Min-Seong</creator><creator>Yoon, Jeong-Won</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>S0W</scope><orcidid>https://orcid.org/0000-0001-8708-542X</orcidid></search><sort><creationdate>20220401</creationdate><title>Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints</title><author>Lee, Dong-Hwan ; Jeong, Min-Seong ; Yoon, Jeong-Won</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-3e372f3551039049ceb254c6ba3e8a496c4aacffc40e71455141954e0ddea72f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Aging</topic><topic>Bonded joints</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Comparative studies</topic><topic>Copper</topic><topic>Ductile fracture</topic><topic>Heat treating</topic><topic>Interface reactions</topic><topic>Intermetallic compounds</topic><topic>Lasers</topic><topic>Lead free</topic><topic>Materials Science</topic><topic>Mechanical properties</topic><topic>Optical and Electronic Materials</topic><topic>Preservatives</topic><topic>Reflow soldering</topic><topic>Shear strength</topic><topic>Shear tests</topic><topic>Side effects</topic><topic>Silver</topic><topic>Solderability</topic><topic>Solders</topic><topic>Substrates</topic><topic>Tin</topic><topic>Tin base alloys</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lee, Dong-Hwan</creatorcontrib><creatorcontrib>Jeong, Min-Seong</creatorcontrib><creatorcontrib>Yoon, Jeong-Won</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>DELNET Engineering & Technology Collection</collection><jtitle>Journal of materials science. Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lee, Dong-Hwan</au><au>Jeong, Min-Seong</au><au>Yoon, Jeong-Won</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints</atitle><jtitle>Journal of materials science. Materials in electronics</jtitle><stitle>J Mater Sci: Mater Electron</stitle><date>2022-04-01</date><risdate>2022</risdate><volume>33</volume><issue>10</issue><spage>7983</spage><epage>7994</epage><pages>7983-7994</pages><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>Laser soldering has attracted attention as an alternative soldering process for micro-soldering that minimizes the side effects of the conventional reflow soldering. In this study, Sn-3.0Ag-0.5Cu (wt.%) solder, a widely used lead-free solder, was bonded on the organic solderability preservative-prepared Cu substrate through laser soldering and reflow soldering, respectively. After the laser and reflow soldering processes, the intermetallic compound (IMC) layer of the joints was analyzed using scanning electron microscopy and energy-dispersive X-ray spectroscopy. Laser soldering formed a thin and flat IMC layer in a short process time. Reflow soldering formed a relatively thick and uneven IMC layer at the interface compared to laser soldering. The different morphologies of the interfacial IMC layers formed by different soldering processes caused the IMC layer to grow differently in the isothermal aging treatment. Ball shear tests were performed to evaluate the mechanical properties of the solder joint. The shear strength of laser soldering that forms a thin IMC layer and fine microstructure was the highest immediately after soldering, but fell to a similar level of reflow-soldered samples after isothermal aging treatment. As the isothermal aging time increased, the brittle fracture area of reflow soldering increased. In the laser soldering, the ductile fracture modes are observed in the whole-aging period.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10854-022-07948-w</doi><tpages>12</tpages><orcidid>https://orcid.org/0000-0001-8708-542X</orcidid></addata></record> |
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subjects | Aging Bonded joints Characterization and Evaluation of Materials Chemistry and Materials Science Comparative studies Copper Ductile fracture Heat treating Interface reactions Intermetallic compounds Lasers Lead free Materials Science Mechanical properties Optical and Electronic Materials Preservatives Reflow soldering Shear strength Shear tests Side effects Silver Solderability Solders Substrates Tin Tin base alloys |
title | Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints |
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