The doping of SZC solders with bismuth to improve their thermal and tensile characteristics for microelectronic applications

Sn–Zn–Cu is one of the most popular soldering alloys, especially when it has been doped with Bi, which has proved very effective. The Sn–6.5Zn–0.3Cu (SZC–0.0Bi) stress–strain characteristics have been tested and compared to the SZC–1.0 Bi and SZC–3.0 Bi solder alloys. The results of the differential...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2022-03, Vol.33 (8), p.4831-4846
Hauptverfasser:	Deghady, A. M., Fadel, M. M., Eid, E. A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Bismuth base alloys Characterization and Evaluation of Materials Chemical precipitation Chemistry and Materials Science Dislocation mobility Materials Science Modulus of elasticity Optical and Electronic Materials Soldering Solders Solid solutions Strain Supercooling Tensile stress Yield stress
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