Prediction and experimental investigation of depth of subsurface damage in semi-consolidated abrasive grinding of cleavable gallium oxide crystals
This paper presents a predictive model of subsurface damage depth h SSD and surface roughness in semi-consolidated abrasive grinding based on indentation fracture theory to rapidly and non-destructively detect subsurface damage of the workpiece. To verify the accuracy of the proposed model, cross-se...
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| Veröffentlicht in: | International journal of advanced manufacturing technology 2022-03, Vol.119 (1-2), p.855-864 |
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| creator | Zhou, Hai Jiang, Wang Ji, Jian Ren, Xiangpu Zhu, Ziyan Zhang, Chunwei |
| description | This paper presents a predictive model of subsurface damage depth
h
SSD
and surface roughness in semi-consolidated abrasive grinding based on indentation fracture theory to rapidly and non-destructively detect subsurface damage of the workpiece. To verify the accuracy of the proposed model, cross-sectional microscopy was used to detect subsurface damage along the (100) and (010) crystal lographic planes in grinding of gallium oxide. In addition, the effects of grinding method, abrasive particle size, grinding pressure, and grinding disc speed on the damage along the (100) and (010) planes were analyzed. The results show a nonlinear relationship between the depth of the gallium oxide subsurface damage and surface roughness generated by semi-consolidated abrasive grinding. Under the same grinding conditions, the damage layer depth in semi-consolidated abrasive grinding is lower than in free abrasive grinding. When the same grinding method is used, the subsurface damage depth is greater along the (100) plane than along the (010) plane under the same grinding conditions. When the abrasive particle size is decreased from W14 to W3, the depth of the subsurface damage layer is reduced by 30% in semi-consolidated abrasive grinding. Reducing the grinding pressure can reduce the amount of subsurface damage, and the speed of the grinding disc also affects the subsurface damage of gallium oxide. The subsurface damage depth has little effect. After optimizing the grinding parameters, the surface roughness of gallium oxide along the (100) and (010) planes was 23 nm and 12 nm, respectively, and
h
SSD
was 2.9 μm and 2.1 μm, respectively. The proposed model of the relationship between subsurface damage depth and surface roughness can be used to achieve rapid, accurate, and non-destructive detection of the depth of subsurface damage and provides technical guidance for subsequent grinding and polishing processes. |
| doi_str_mv | 10.1007/s00170-021-08311-9 |
| format | Article |
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h
SSD
and surface roughness in semi-consolidated abrasive grinding based on indentation fracture theory to rapidly and non-destructively detect subsurface damage of the workpiece. To verify the accuracy of the proposed model, cross-sectional microscopy was used to detect subsurface damage along the (100) and (010) crystal lographic planes in grinding of gallium oxide. In addition, the effects of grinding method, abrasive particle size, grinding pressure, and grinding disc speed on the damage along the (100) and (010) planes were analyzed. The results show a nonlinear relationship between the depth of the gallium oxide subsurface damage and surface roughness generated by semi-consolidated abrasive grinding. Under the same grinding conditions, the damage layer depth in semi-consolidated abrasive grinding is lower than in free abrasive grinding. When the same grinding method is used, the subsurface damage depth is greater along the (100) plane than along the (010) plane under the same grinding conditions. When the abrasive particle size is decreased from W14 to W3, the depth of the subsurface damage layer is reduced by 30% in semi-consolidated abrasive grinding. Reducing the grinding pressure can reduce the amount of subsurface damage, and the speed of the grinding disc also affects the subsurface damage of gallium oxide. The subsurface damage depth has little effect. After optimizing the grinding parameters, the surface roughness of gallium oxide along the (100) and (010) planes was 23 nm and 12 nm, respectively, and
h
SSD
was 2.9 μm and 2.1 μm, respectively. The proposed model of the relationship between subsurface damage depth and surface roughness can be used to achieve rapid, accurate, and non-destructive detection of the depth of subsurface damage and provides technical guidance for subsequent grinding and polishing processes.</description><identifier>ISSN: 0268-3768</identifier><identifier>EISSN: 1433-3015</identifier><identifier>DOI: 10.1007/s00170-021-08311-9</identifier><language>eng</language><publisher>London: Springer London</publisher><subject>CAE) and Design ; Computer-Aided Engineering (CAD ; Consolidation ; Damage detection ; Engineering ; Gallium oxides ; Grinding ; Indentation ; Industrial and Production Engineering ; Mechanical Engineering ; Media Management ; Original Article ; Particle size ; Prediction models ; Surface roughness ; Workpieces</subject><ispartof>International journal of advanced manufacturing technology, 2022-03, Vol.119 (1-2), p.855-864</ispartof><rights>The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2021</rights><rights>The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2021.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-64764475d50c5da077d848488a8d1b33ca2db6cab3f3aba759aee431707a3e443</citedby><cites>FETCH-LOGICAL-c319t-64764475d50c5da077d848488a8d1b33ca2db6cab3f3aba759aee431707a3e443</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s00170-021-08311-9$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s00170-021-08311-9$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Zhou, Hai</creatorcontrib><creatorcontrib>Jiang, Wang</creatorcontrib><creatorcontrib>Ji, Jian</creatorcontrib><creatorcontrib>Ren, Xiangpu</creatorcontrib><creatorcontrib>Zhu, Ziyan</creatorcontrib><creatorcontrib>Zhang, Chunwei</creatorcontrib><title>Prediction and experimental investigation of depth of subsurface damage in semi-consolidated abrasive grinding of cleavable gallium oxide crystals</title><title>International journal of advanced manufacturing technology</title><addtitle>Int J Adv Manuf Technol</addtitle><description>This paper presents a predictive model of subsurface damage depth
h
SSD
and surface roughness in semi-consolidated abrasive grinding based on indentation fracture theory to rapidly and non-destructively detect subsurface damage of the workpiece. To verify the accuracy of the proposed model, cross-sectional microscopy was used to detect subsurface damage along the (100) and (010) crystal lographic planes in grinding of gallium oxide. In addition, the effects of grinding method, abrasive particle size, grinding pressure, and grinding disc speed on the damage along the (100) and (010) planes were analyzed. The results show a nonlinear relationship between the depth of the gallium oxide subsurface damage and surface roughness generated by semi-consolidated abrasive grinding. Under the same grinding conditions, the damage layer depth in semi-consolidated abrasive grinding is lower than in free abrasive grinding. When the same grinding method is used, the subsurface damage depth is greater along the (100) plane than along the (010) plane under the same grinding conditions. When the abrasive particle size is decreased from W14 to W3, the depth of the subsurface damage layer is reduced by 30% in semi-consolidated abrasive grinding. Reducing the grinding pressure can reduce the amount of subsurface damage, and the speed of the grinding disc also affects the subsurface damage of gallium oxide. The subsurface damage depth has little effect. After optimizing the grinding parameters, the surface roughness of gallium oxide along the (100) and (010) planes was 23 nm and 12 nm, respectively, and
h
SSD
was 2.9 μm and 2.1 μm, respectively. The proposed model of the relationship between subsurface damage depth and surface roughness can be used to achieve rapid, accurate, and non-destructive detection of the depth of subsurface damage and provides technical guidance for subsequent grinding and polishing processes.</description><subject>CAE) and Design</subject><subject>Computer-Aided Engineering (CAD</subject><subject>Consolidation</subject><subject>Damage detection</subject><subject>Engineering</subject><subject>Gallium oxides</subject><subject>Grinding</subject><subject>Indentation</subject><subject>Industrial and Production Engineering</subject><subject>Mechanical Engineering</subject><subject>Media Management</subject><subject>Original Article</subject><subject>Particle size</subject><subject>Prediction models</subject><subject>Surface roughness</subject><subject>Workpieces</subject><issn>0268-3768</issn><issn>1433-3015</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp9kM-O2yAQh1HVSk3TvkBPSD2zBWMDOVZR948Uafewe0ZjGLtEDk7BjpLX2CcuSSrtbcVh0PD9ZsRHyHfBbwTn-mfmXGjOeCUYN1IItvpAFqKWkkkumo9kwStlmNTKfCZfct4WXAllFuT1KaEPbgpjpBA9xeMeU9hhnGCgIR4wT6GHy_PYUY_76c_5kuc2z6kDh9TDDnosLM24C8yNMY9D8DChp9AmyOGAtE8h-hD7c9YNCAdoh9KFYQjzjo7H4JG6dMpla_5KPnWl4Lf_dUlebn8_r-_Z5vHuYf1rw5wUq4mpWqu61o1vuGs8cK29qcsxYLxopXRQ-VY5aGUnoQXdrACxlkWTBol1LZfkx3XuPo1_5_JRux3nFMtKWynJlTGGN4WqrpRLY84JO7svfiCdrOD27N5e3dvi3l7c21UJyWsoFzj2mN5Gv5P6B3clioo</recordid><startdate>20220301</startdate><enddate>20220301</enddate><creator>Zhou, Hai</creator><creator>Jiang, Wang</creator><creator>Ji, Jian</creator><creator>Ren, Xiangpu</creator><creator>Zhu, Ziyan</creator><creator>Zhang, Chunwei</creator><general>Springer London</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>L6V</scope><scope>M7S</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope></search><sort><creationdate>20220301</creationdate><title>Prediction and experimental investigation of depth of subsurface damage in semi-consolidated abrasive grinding of cleavable gallium oxide crystals</title><author>Zhou, Hai ; Jiang, Wang ; Ji, Jian ; Ren, Xiangpu ; Zhu, Ziyan ; Zhang, Chunwei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-64764475d50c5da077d848488a8d1b33ca2db6cab3f3aba759aee431707a3e443</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>CAE) and Design</topic><topic>Computer-Aided Engineering (CAD</topic><topic>Consolidation</topic><topic>Damage detection</topic><topic>Engineering</topic><topic>Gallium oxides</topic><topic>Grinding</topic><topic>Indentation</topic><topic>Industrial and Production Engineering</topic><topic>Mechanical Engineering</topic><topic>Media Management</topic><topic>Original Article</topic><topic>Particle size</topic><topic>Prediction models</topic><topic>Surface roughness</topic><topic>Workpieces</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zhou, Hai</creatorcontrib><creatorcontrib>Jiang, Wang</creatorcontrib><creatorcontrib>Ji, Jian</creatorcontrib><creatorcontrib>Ren, Xiangpu</creatorcontrib><creatorcontrib>Zhu, Ziyan</creatorcontrib><creatorcontrib>Zhang, Chunwei</creatorcontrib><collection>CrossRef</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><jtitle>International journal of advanced manufacturing technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zhou, Hai</au><au>Jiang, Wang</au><au>Ji, Jian</au><au>Ren, Xiangpu</au><au>Zhu, Ziyan</au><au>Zhang, Chunwei</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Prediction and experimental investigation of depth of subsurface damage in semi-consolidated abrasive grinding of cleavable gallium oxide crystals</atitle><jtitle>International journal of advanced manufacturing technology</jtitle><stitle>Int J Adv Manuf Technol</stitle><date>2022-03-01</date><risdate>2022</risdate><volume>119</volume><issue>1-2</issue><spage>855</spage><epage>864</epage><pages>855-864</pages><issn>0268-3768</issn><eissn>1433-3015</eissn><abstract>This paper presents a predictive model of subsurface damage depth
h
SSD
and surface roughness in semi-consolidated abrasive grinding based on indentation fracture theory to rapidly and non-destructively detect subsurface damage of the workpiece. To verify the accuracy of the proposed model, cross-sectional microscopy was used to detect subsurface damage along the (100) and (010) crystal lographic planes in grinding of gallium oxide. In addition, the effects of grinding method, abrasive particle size, grinding pressure, and grinding disc speed on the damage along the (100) and (010) planes were analyzed. The results show a nonlinear relationship between the depth of the gallium oxide subsurface damage and surface roughness generated by semi-consolidated abrasive grinding. Under the same grinding conditions, the damage layer depth in semi-consolidated abrasive grinding is lower than in free abrasive grinding. When the same grinding method is used, the subsurface damage depth is greater along the (100) plane than along the (010) plane under the same grinding conditions. When the abrasive particle size is decreased from W14 to W3, the depth of the subsurface damage layer is reduced by 30% in semi-consolidated abrasive grinding. Reducing the grinding pressure can reduce the amount of subsurface damage, and the speed of the grinding disc also affects the subsurface damage of gallium oxide. The subsurface damage depth has little effect. After optimizing the grinding parameters, the surface roughness of gallium oxide along the (100) and (010) planes was 23 nm and 12 nm, respectively, and
h
SSD
was 2.9 μm and 2.1 μm, respectively. The proposed model of the relationship between subsurface damage depth and surface roughness can be used to achieve rapid, accurate, and non-destructive detection of the depth of subsurface damage and provides technical guidance for subsequent grinding and polishing processes.</abstract><cop>London</cop><pub>Springer London</pub><doi>10.1007/s00170-021-08311-9</doi><tpages>10</tpages></addata></record> |
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| subjects | CAE) and Design Computer-Aided Engineering (CAD Consolidation Damage detection Engineering Gallium oxides Grinding Indentation Industrial and Production Engineering Mechanical Engineering Media Management Original Article Particle size Prediction models Surface roughness Workpieces |
| title | Prediction and experimental investigation of depth of subsurface damage in semi-consolidated abrasive grinding of cleavable gallium oxide crystals |
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