Metallurgically and mechanically reliable microsilver-sintered joints for automotive power module applications

Conventional soldering methods with Pb-containing and Pb-free solder alloys have been extensively used in the manufacturing of the power modules. However, other reliable bonding methods that replace these conventional solders must be considered, because the solder alloys have an insufficient reliabi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of materials science. Materials in electronics 2022, Vol.33 (3), p.1724-1737
Hauptverfasser: Yoon, Jeong-Won, Back, Jong-Hoon
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!