Metallurgically and mechanically reliable microsilver-sintered joints for automotive power module applications
Conventional soldering methods with Pb-containing and Pb-free solder alloys have been extensively used in the manufacturing of the power modules. However, other reliable bonding methods that replace these conventional solders must be considered, because the solder alloys have an insufficient reliabi...
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Veröffentlicht in: | Journal of materials science. Materials in electronics 2022, Vol.33 (3), p.1724-1737 |
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Hauptverfasser: | , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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