Strength and thermal shock resistance of fiber‐bonded Si‐Al‐C‐O and Si‐Ti‐C‐O ceramics

Silicon carbide‐based fiber‐bonded ceramics, obtained from hot pressing of woven silicon carbide fibers, are a cost‐effective alternative to ceramic‐matrix composites due to their ease of fabrication, involving few processing steps, and competitive thermomechanical properties. In this work, we studied the high‐temperature strength and thermal shock resistance of Si‐Al‐C‐O and Si‐Ti‐C‐O fiber‐bonded SiC ceramics obtained from hot pressing of two types of ceramic fibers, by mechanical testing in four‐point bending. The bending strength of Si‐Al‐C‐O‐based fiber‐bonded ceramics at room temperature is ∼250–260 MPa and remains constant with temperature, while the bending strength of Si‐Ti‐C‐O increases slightly from the initial 220 to ∼250 MPa for the highest temperature. Both materials retain up to 90% of their room temperature strength after thermal shocks of 1400°C and show no reduction in elastic moduli. After thermal shock, failure mode is the same as in the case of as‐received materials.