Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems

In the present study, various amounts of Bi were added to two groups of Sn-In-Zn lead-free solder alloy systems (Sn-[x] Bi-2In-9Zn ( x = 4,14,24) and Sn-[x]Bi-5In-9Zn ( x = 1,6,10) to investigate the Bi effect on microstructural, mechanical and thermal properties to obtain optimal lead-free altern...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of materials science. Materials in electronics 2022-01, Vol.33 (1), p.11-26
Hauptverfasser:	Aksöz, Sezen, Esener, Pınar Ata, Öztürk, Esra, Maraşlı, Necmettin
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloy systems Bismuth Characterization and Evaluation of Materials Chemistry and Materials Science Energy dispersive X ray analysis Enthalpy Heat exchange Lead free Materials Science Mechanical properties Melt temperature Melting Microhardness Microstructure Optical and Electronic Materials Solders Solid phases Tensile strength Thermodynamic properties X ray analysis
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!