Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology-Sensing Head Interfacing
This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor...
Gespeichert in:
Veröffentlicht in: | IEEE sensors journal 2022-01, Vol.22 (2), p.1309-1320 |
---|---|
Hauptverfasser: | , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | 1320 |
---|---|
container_issue | 2 |
container_start_page | 1309 |
container_title | IEEE sensors journal |
container_volume | 22 |
creator | Chen, Shiying Vilchis-Rodriguez, Damian Djurovic, Sinisa Barnes, Mike Mckeever, Paul Jia, Chunjiang |
description | This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device. |
doi_str_mv | 10.1109/JSEN.2021.3131322 |
format | Article |
fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_proquest_journals_2619023743</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>9627981</ieee_id><sourcerecordid>2619023743</sourcerecordid><originalsourceid>FETCH-LOGICAL-c293t-e5ebfaf1d784a341b089bc1dc5a19239cb40832a41994f90093b28d8d403ff703</originalsourceid><addsrcrecordid>eNo9kM1OwzAQhCMEEqXwAIiLJc4pXttp7CMt_UMtHJpK3IyTbNpUaVLs5NC3J6EV2sOuRjM70ud5j0AHAFS9vK8nHwNGGQw4tMPYldeDIJA-hEJedzenvuDh161359yeUlBhEPa877fcYlKTqiTjXX4k0Q7twRRkhcY1Fg9Y1iQvyWI2isiqSpsCHdm4vNyS6WhGIkx2ZVVU25O_xvJPnqNJyaKs0WYmaYV77yYzhcOHy-57m-kkGs_95edsMX5d-glTvPYxwDgzGaShFIYLiKlUcQJpEhhQjKskFlRyZgQoJTJFqeIxk6lMBeVZFlLe957Pf4-2-mnQ1XpfNbZsKzUbgqKMh4K3Lji7Els5ZzHTR5sfjD1poLoDqTuQugOpLyDbzNM5kyPiv18NWagk8F-SoW2x</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2619023743</pqid></control><display><type>article</type><title>Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology-Sensing Head Interfacing</title><source>IEEE Electronic Library (IEL)</source><creator>Chen, Shiying ; Vilchis-Rodriguez, Damian ; Djurovic, Sinisa ; Barnes, Mike ; Mckeever, Paul ; Jia, Chunjiang</creator><creatorcontrib>Chen, Shiying ; Vilchis-Rodriguez, Damian ; Djurovic, Sinisa ; Barnes, Mike ; Mckeever, Paul ; Jia, Chunjiang</creatorcontrib><description>This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device.</description><identifier>ISSN: 1530-437X</identifier><identifier>EISSN: 1558-1748</identifier><identifier>DOI: 10.1109/JSEN.2021.3131322</identifier><identifier>CODEN: ISJEAZ</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Bragg gratings ; FBG ; Fiber gratings ; IGBT ; in-situ sensing ; Insulated gate bipolar transistors ; Junctions ; Laboratory tests ; Load modeling ; Modules ; Optical fiber sensors ; Optical measuring instruments ; optical-fiber ; Temperature measurement ; Temperature sensors ; Thermal measurement ; thermal sensing</subject><ispartof>IEEE sensors journal, 2022-01, Vol.22 (2), p.1309-1320</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c293t-e5ebfaf1d784a341b089bc1dc5a19239cb40832a41994f90093b28d8d403ff703</citedby><cites>FETCH-LOGICAL-c293t-e5ebfaf1d784a341b089bc1dc5a19239cb40832a41994f90093b28d8d403ff703</cites><orcidid>0000-0003-2061-1207 ; 0000-0002-6614-8839 ; 0000-0001-7700-6492 ; 0000-0002-3422-602X</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/9627981$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/9627981$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Chen, Shiying</creatorcontrib><creatorcontrib>Vilchis-Rodriguez, Damian</creatorcontrib><creatorcontrib>Djurovic, Sinisa</creatorcontrib><creatorcontrib>Barnes, Mike</creatorcontrib><creatorcontrib>Mckeever, Paul</creatorcontrib><creatorcontrib>Jia, Chunjiang</creatorcontrib><title>Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology-Sensing Head Interfacing</title><title>IEEE sensors journal</title><addtitle>JSEN</addtitle><description>This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device.</description><subject>Bragg gratings</subject><subject>FBG</subject><subject>Fiber gratings</subject><subject>IGBT</subject><subject>in-situ sensing</subject><subject>Insulated gate bipolar transistors</subject><subject>Junctions</subject><subject>Laboratory tests</subject><subject>Load modeling</subject><subject>Modules</subject><subject>Optical fiber sensors</subject><subject>Optical measuring instruments</subject><subject>optical-fiber</subject><subject>Temperature measurement</subject><subject>Temperature sensors</subject><subject>Thermal measurement</subject><subject>thermal sensing</subject><issn>1530-437X</issn><issn>1558-1748</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kM1OwzAQhCMEEqXwAIiLJc4pXttp7CMt_UMtHJpK3IyTbNpUaVLs5NC3J6EV2sOuRjM70ud5j0AHAFS9vK8nHwNGGQw4tMPYldeDIJA-hEJedzenvuDh161359yeUlBhEPa877fcYlKTqiTjXX4k0Q7twRRkhcY1Fg9Y1iQvyWI2isiqSpsCHdm4vNyS6WhGIkx2ZVVU25O_xvJPnqNJyaKs0WYmaYV77yYzhcOHy-57m-kkGs_95edsMX5d-glTvPYxwDgzGaShFIYLiKlUcQJpEhhQjKskFlRyZgQoJTJFqeIxk6lMBeVZFlLe957Pf4-2-mnQ1XpfNbZsKzUbgqKMh4K3Lji7Els5ZzHTR5sfjD1poLoDqTuQugOpLyDbzNM5kyPiv18NWagk8F-SoW2x</recordid><startdate>20220115</startdate><enddate>20220115</enddate><creator>Chen, Shiying</creator><creator>Vilchis-Rodriguez, Damian</creator><creator>Djurovic, Sinisa</creator><creator>Barnes, Mike</creator><creator>Mckeever, Paul</creator><creator>Jia, Chunjiang</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0003-2061-1207</orcidid><orcidid>https://orcid.org/0000-0002-6614-8839</orcidid><orcidid>https://orcid.org/0000-0001-7700-6492</orcidid><orcidid>https://orcid.org/0000-0002-3422-602X</orcidid></search><sort><creationdate>20220115</creationdate><title>Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology-Sensing Head Interfacing</title><author>Chen, Shiying ; Vilchis-Rodriguez, Damian ; Djurovic, Sinisa ; Barnes, Mike ; Mckeever, Paul ; Jia, Chunjiang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c293t-e5ebfaf1d784a341b089bc1dc5a19239cb40832a41994f90093b28d8d403ff703</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Bragg gratings</topic><topic>FBG</topic><topic>Fiber gratings</topic><topic>IGBT</topic><topic>in-situ sensing</topic><topic>Insulated gate bipolar transistors</topic><topic>Junctions</topic><topic>Laboratory tests</topic><topic>Load modeling</topic><topic>Modules</topic><topic>Optical fiber sensors</topic><topic>Optical measuring instruments</topic><topic>optical-fiber</topic><topic>Temperature measurement</topic><topic>Temperature sensors</topic><topic>Thermal measurement</topic><topic>thermal sensing</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, Shiying</creatorcontrib><creatorcontrib>Vilchis-Rodriguez, Damian</creatorcontrib><creatorcontrib>Djurovic, Sinisa</creatorcontrib><creatorcontrib>Barnes, Mike</creatorcontrib><creatorcontrib>Mckeever, Paul</creatorcontrib><creatorcontrib>Jia, Chunjiang</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE sensors journal</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chen, Shiying</au><au>Vilchis-Rodriguez, Damian</au><au>Djurovic, Sinisa</au><au>Barnes, Mike</au><au>Mckeever, Paul</au><au>Jia, Chunjiang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology-Sensing Head Interfacing</atitle><jtitle>IEEE sensors journal</jtitle><stitle>JSEN</stitle><date>2022-01-15</date><risdate>2022</risdate><volume>22</volume><issue>2</issue><spage>1309</spage><epage>1320</epage><pages>1309-1320</pages><issn>1530-437X</issn><eissn>1558-1748</eissn><coden>ISJEAZ</coden><abstract>This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JSEN.2021.3131322</doi><tpages>12</tpages><orcidid>https://orcid.org/0000-0003-2061-1207</orcidid><orcidid>https://orcid.org/0000-0002-6614-8839</orcidid><orcidid>https://orcid.org/0000-0001-7700-6492</orcidid><orcidid>https://orcid.org/0000-0002-3422-602X</orcidid></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | ISSN: 1530-437X |
ispartof | IEEE sensors journal, 2022-01, Vol.22 (2), p.1309-1320 |
issn | 1530-437X 1558-1748 |
language | eng |
recordid | cdi_proquest_journals_2619023743 |
source | IEEE Electronic Library (IEL) |
subjects | Bragg gratings FBG Fiber gratings IGBT in-situ sensing Insulated gate bipolar transistors Junctions Laboratory tests Load modeling Modules Optical fiber sensors Optical measuring instruments optical-fiber Temperature measurement Temperature sensors Thermal measurement thermal sensing |
title | Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology-Sensing Head Interfacing |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T19%3A13%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Direct%20on%20Chip%20Thermal%20Measurement%20in%20IGBT%20Modules%20Using%20FBG%20Technology-Sensing%20Head%20Interfacing&rft.jtitle=IEEE%20sensors%20journal&rft.au=Chen,%20Shiying&rft.date=2022-01-15&rft.volume=22&rft.issue=2&rft.spage=1309&rft.epage=1320&rft.pages=1309-1320&rft.issn=1530-437X&rft.eissn=1558-1748&rft.coden=ISJEAZ&rft_id=info:doi/10.1109/JSEN.2021.3131322&rft_dat=%3Cproquest_RIE%3E2619023743%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2619023743&rft_id=info:pmid/&rft_ieee_id=9627981&rfr_iscdi=true |