The Effect of Electric-Thermal-Vibration Stress Coupling on the Reliability of Sn-Ag-Cu Solder Joints

The damage of the package structure, caused by the multi-stress coupling of various environmental factors, can lead to the failure of the electronic device. Therefore, through the finite element method, the reliability analysis of three kinds of lead-free Sn-Ag-Cu solders (SAC105, SAC305, SAC405) in...

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Veröffentlicht in:	Journal of electronic materials 2022-01, Vol.51 (1), p.284-294
Hauptverfasser:	Hu, Xinlan, He, Liang, Chen, Hua, Lv, Yunxuan, Gao, Haowen, Liu, Juncheng
Format:	Artikel
Sprache:	eng
Schlagworte:	Ball grid packaging Band theory Characterization and Evaluation of Materials Chemistry and Materials Science Copper Coupling Damage Electronics and Microelectronics Empirical analysis Fatigue life Finite element method High cycle fatigue Instrumentation Lead free Materials Science Optical and Electronic Materials Original Research Article Plastic deformation Random vibration Reliability analysis S N diagrams Silver Solders Solid State Physics Strain Thermoelectricity Tin Tin base alloys
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