Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents
•Sn-Cu-Ni alloys were electrodeposited from two types of deep eutectic solvents.•The type of deep eutectic solvent influences the alloy adhesion on Cu substrate.•Electrodeposition process follows a 3-D instantaneous nucleation mechanism.•Sn-Cu-Ni alloy coatings showed good corrosion performance and...
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| Veröffentlicht in: | Electrochimica acta 2021-12, Vol.398, p.139339, Article 139339 |
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| creator | Rosoiu, Sabrina Patricia Costovici, Stefania Moise, Calin Petica, Aurora Anicai, Liana Visan, Teodor Enachescu, Marius |
| description | •Sn-Cu-Ni alloys were electrodeposited from two types of deep eutectic solvents.•The type of deep eutectic solvent influences the alloy adhesion on Cu substrate.•Electrodeposition process follows a 3-D instantaneous nucleation mechanism.•Sn-Cu-Ni alloy coatings showed good corrosion performance and solderability.•A stoichiometry of Sn99.29-Cu0.65-Ni0.06 was obtained able to act as Pb-free solder.
The paper presents several experimental results regarding the electrodeposition of Sn-Cu-Ni ternary alloys as an attractive lead-free solder candidate, involving deep eutectic solvents (DESs), namely using choline chloride-ethylene glycol and choline chloride-malonic acid eutectic mixtures. The influence of the metallic ions concentration in the electrolyte and of the applied current density on the Sn-Cu-Ni alloy composition and morphology has been investigated, in order to achieve the corresponding alloy composition (Sn99.4Cu0.6 alloy + Ni) able to possess the eutectic or near eutectic melting temperature of about 227 °C. Adherent, bright and uniform Sn-Cu-Ni alloy deposits have been obtained onto Cu substrate from choline chloride-ethylene glycol-based electrolytes for applied current densities between 5–8 mA.cm−2 at 60 °C. According to the TGA measurements, values of melting point of 229 °C have been obtained, corresponding to an alloy stoichiometry of Sn99.29-Cu0.65-Ni0.06 as indicated by EDX elemental analysis. In addition, analysis of the current-time curves using the Scharifker-Hills’ model suggested that the alloy deposition process corresponds to a nucleation and tridimensional growth controlled by diffusion mostly under instantaneous nucleation. Preliminary results related to the solder joints behavior showed adequate solderability characteristics and adhesion to the substrate with no fractures. Moreover, the electrodeposited Sn-Cu-Ni (Sn99.29-Cu0.65-Ni0.06) alloy coatings exhibited a slightly better corrosion performance as compared to Sn-Ni alloys electrodeposited from DESs and to the metallurgically prepared lead-free solders possessing a relatively similar composition.
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| doi_str_mv | 10.1016/j.electacta.2021.139339 |
| format | Article |
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The paper presents several experimental results regarding the electrodeposition of Sn-Cu-Ni ternary alloys as an attractive lead-free solder candidate, involving deep eutectic solvents (DESs), namely using choline chloride-ethylene glycol and choline chloride-malonic acid eutectic mixtures. The influence of the metallic ions concentration in the electrolyte and of the applied current density on the Sn-Cu-Ni alloy composition and morphology has been investigated, in order to achieve the corresponding alloy composition (Sn99.4Cu0.6 alloy + Ni) able to possess the eutectic or near eutectic melting temperature of about 227 °C. Adherent, bright and uniform Sn-Cu-Ni alloy deposits have been obtained onto Cu substrate from choline chloride-ethylene glycol-based electrolytes for applied current densities between 5–8 mA.cm−2 at 60 °C. According to the TGA measurements, values of melting point of 229 °C have been obtained, corresponding to an alloy stoichiometry of Sn99.29-Cu0.65-Ni0.06 as indicated by EDX elemental analysis. In addition, analysis of the current-time curves using the Scharifker-Hills’ model suggested that the alloy deposition process corresponds to a nucleation and tridimensional growth controlled by diffusion mostly under instantaneous nucleation. Preliminary results related to the solder joints behavior showed adequate solderability characteristics and adhesion to the substrate with no fractures. Moreover, the electrodeposited Sn-Cu-Ni (Sn99.29-Cu0.65-Ni0.06) alloy coatings exhibited a slightly better corrosion performance as compared to Sn-Ni alloys electrodeposited from DESs and to the metallurgically prepared lead-free solders possessing a relatively similar composition.
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The paper presents several experimental results regarding the electrodeposition of Sn-Cu-Ni ternary alloys as an attractive lead-free solder candidate, involving deep eutectic solvents (DESs), namely using choline chloride-ethylene glycol and choline chloride-malonic acid eutectic mixtures. The influence of the metallic ions concentration in the electrolyte and of the applied current density on the Sn-Cu-Ni alloy composition and morphology has been investigated, in order to achieve the corresponding alloy composition (Sn99.4Cu0.6 alloy + Ni) able to possess the eutectic or near eutectic melting temperature of about 227 °C. Adherent, bright and uniform Sn-Cu-Ni alloy deposits have been obtained onto Cu substrate from choline chloride-ethylene glycol-based electrolytes for applied current densities between 5–8 mA.cm−2 at 60 °C. According to the TGA measurements, values of melting point of 229 °C have been obtained, corresponding to an alloy stoichiometry of Sn99.29-Cu0.65-Ni0.06 as indicated by EDX elemental analysis. In addition, analysis of the current-time curves using the Scharifker-Hills’ model suggested that the alloy deposition process corresponds to a nucleation and tridimensional growth controlled by diffusion mostly under instantaneous nucleation. Preliminary results related to the solder joints behavior showed adequate solderability characteristics and adhesion to the substrate with no fractures. Moreover, the electrodeposited Sn-Cu-Ni (Sn99.29-Cu0.65-Ni0.06) alloy coatings exhibited a slightly better corrosion performance as compared to Sn-Ni alloys electrodeposited from DESs and to the metallurgically prepared lead-free solders possessing a relatively similar composition.
[Display omitted]</description><subject>Alloys</subject><subject>Chlorides</subject><subject>Choline</subject><subject>Coated electrodes</subject><subject>Composition</subject><subject>Copper</subject><subject>Copper base alloys</subject><subject>Corrosion behavior</subject><subject>Current density</subject><subject>Deep eutectic solvents</subject><subject>Electrodeposition</subject><subject>Electrolytes</subject><subject>Ethylene glycol</subject><subject>Eutectic temperature</subject><subject>Fractures</subject><subject>Lead free</subject><subject>Lead-free solder alloy</subject><subject>Melt temperature</subject><subject>Melting points</subject><subject>Nickel</subject><subject>Nucleation</subject><subject>Sn-Cu-Ni alloy</subject><subject>Solderability</subject><subject>Solders</subject><subject>Solvents</subject><subject>Stoichiometry</subject><subject>Substrates</subject><subject>Ternary alloys</subject><subject>Tin base alloys</subject><issn>0013-4686</issn><issn>1873-3859</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><recordid>eNqFkE1LxDAURYMoOI7-BgOuU5OmTdrlMIwfMOhC3Royyauk1KYm7YD_3pSKWyHwFjn3wj0IXTOaMcrEbZtBB2bU6WU5zVnGeM15fYJWrJKc8KqsT9GKUsZJISpxji5ibCmlUki6Qu-7ORy8hcFHNzrfY9_gEUKvwzd-6cl2Ik8O667z3xHriDvQljQBAEffWQgRT9H1H9gCDBimMbU5M_8doR_jJTprdBfh6veu0dvd7nX7QPbP94_bzZ4YXucjaVhjeAlQFoVghmsmm9oAO1SHykp6oAXkUkqrpRG0Kq2pdOJtQytZyoJSwdfoZukdgv-aII6q9VPa0EWVp0jNeClkouRCmeBjDNCoIbjPNFQxqmaZqlV_MtUsUy0yU3KzJCGNODoIKhoHvQHrQuKV9e7fjh9qCoJ5</recordid><startdate>20211201</startdate><enddate>20211201</enddate><creator>Rosoiu, Sabrina Patricia</creator><creator>Costovici, Stefania</creator><creator>Moise, Calin</creator><creator>Petica, Aurora</creator><creator>Anicai, Liana</creator><creator>Visan, Teodor</creator><creator>Enachescu, Marius</creator><general>Elsevier Ltd</general><general>Elsevier BV</general><scope>6I.</scope><scope>AAFTH</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-1453-3997</orcidid><orcidid>https://orcid.org/0000-0002-1145-2948</orcidid></search><sort><creationdate>20211201</creationdate><title>Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents</title><author>Rosoiu, Sabrina Patricia ; Costovici, Stefania ; Moise, Calin ; Petica, Aurora ; Anicai, Liana ; Visan, Teodor ; Enachescu, Marius</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c392t-f1fc35ee54461c3a17f9ce1b8b8d70b04e2777da7c6085dc8afc3df0875740063</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Alloys</topic><topic>Chlorides</topic><topic>Choline</topic><topic>Coated electrodes</topic><topic>Composition</topic><topic>Copper</topic><topic>Copper base alloys</topic><topic>Corrosion behavior</topic><topic>Current density</topic><topic>Deep eutectic solvents</topic><topic>Electrodeposition</topic><topic>Electrolytes</topic><topic>Ethylene glycol</topic><topic>Eutectic temperature</topic><topic>Fractures</topic><topic>Lead free</topic><topic>Lead-free solder alloy</topic><topic>Melt temperature</topic><topic>Melting points</topic><topic>Nickel</topic><topic>Nucleation</topic><topic>Sn-Cu-Ni alloy</topic><topic>Solderability</topic><topic>Solders</topic><topic>Solvents</topic><topic>Stoichiometry</topic><topic>Substrates</topic><topic>Ternary alloys</topic><topic>Tin base alloys</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Rosoiu, Sabrina Patricia</creatorcontrib><creatorcontrib>Costovici, Stefania</creatorcontrib><creatorcontrib>Moise, Calin</creatorcontrib><creatorcontrib>Petica, Aurora</creatorcontrib><creatorcontrib>Anicai, Liana</creatorcontrib><creatorcontrib>Visan, Teodor</creatorcontrib><creatorcontrib>Enachescu, Marius</creatorcontrib><collection>ScienceDirect Open Access Titles</collection><collection>Elsevier:ScienceDirect:Open Access</collection><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Electrochimica acta</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Rosoiu, Sabrina Patricia</au><au>Costovici, Stefania</au><au>Moise, Calin</au><au>Petica, Aurora</au><au>Anicai, Liana</au><au>Visan, Teodor</au><au>Enachescu, Marius</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents</atitle><jtitle>Electrochimica acta</jtitle><date>2021-12-01</date><risdate>2021</risdate><volume>398</volume><spage>139339</spage><pages>139339-</pages><artnum>139339</artnum><issn>0013-4686</issn><eissn>1873-3859</eissn><abstract>•Sn-Cu-Ni alloys were electrodeposited from two types of deep eutectic solvents.•The type of deep eutectic solvent influences the alloy adhesion on Cu substrate.•Electrodeposition process follows a 3-D instantaneous nucleation mechanism.•Sn-Cu-Ni alloy coatings showed good corrosion performance and solderability.•A stoichiometry of Sn99.29-Cu0.65-Ni0.06 was obtained able to act as Pb-free solder.
The paper presents several experimental results regarding the electrodeposition of Sn-Cu-Ni ternary alloys as an attractive lead-free solder candidate, involving deep eutectic solvents (DESs), namely using choline chloride-ethylene glycol and choline chloride-malonic acid eutectic mixtures. The influence of the metallic ions concentration in the electrolyte and of the applied current density on the Sn-Cu-Ni alloy composition and morphology has been investigated, in order to achieve the corresponding alloy composition (Sn99.4Cu0.6 alloy + Ni) able to possess the eutectic or near eutectic melting temperature of about 227 °C. Adherent, bright and uniform Sn-Cu-Ni alloy deposits have been obtained onto Cu substrate from choline chloride-ethylene glycol-based electrolytes for applied current densities between 5–8 mA.cm−2 at 60 °C. According to the TGA measurements, values of melting point of 229 °C have been obtained, corresponding to an alloy stoichiometry of Sn99.29-Cu0.65-Ni0.06 as indicated by EDX elemental analysis. In addition, analysis of the current-time curves using the Scharifker-Hills’ model suggested that the alloy deposition process corresponds to a nucleation and tridimensional growth controlled by diffusion mostly under instantaneous nucleation. Preliminary results related to the solder joints behavior showed adequate solderability characteristics and adhesion to the substrate with no fractures. Moreover, the electrodeposited Sn-Cu-Ni (Sn99.29-Cu0.65-Ni0.06) alloy coatings exhibited a slightly better corrosion performance as compared to Sn-Ni alloys electrodeposited from DESs and to the metallurgically prepared lead-free solders possessing a relatively similar composition.
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| subjects | Alloys Chlorides Choline Coated electrodes Composition Copper Copper base alloys Corrosion behavior Current density Deep eutectic solvents Electrodeposition Electrolytes Ethylene glycol Eutectic temperature Fractures Lead free Lead-free solder alloy Melt temperature Melting points Nickel Nucleation Sn-Cu-Ni alloy Solderability Solders Solvents Stoichiometry Substrates Ternary alloys Tin base alloys |
| title | Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents |
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