Numerical Analysis of Thermal Management of On-Chip Circuits

Electronic systems are anticipated to give superior Quality-of-Service parameters such as fast speed, thin size, and high efficiency for future generation systems. The main issue in producing high functionality systems is heat dissipation at the working units. This is due to the fact that the operating temperature of electronic systems for commercial applications is limited to 70 °C, beyond which the electronic circuits may malfunction and cause the entire system to fail. As a result, heat optimization of electronic circuits is a critical solution for meeting the increased functionality and denser circuits for on-chip systems in any thin sized end products. In this work, the experimental unit is modeled to examine the forced convective modes of fluid and heat transfer characteristics are demonstrated. It has been discovered that turbulent fluid flow when propagated in multichannel has a superior heat transfer effect and optimizes the latent heat created at the circuit.