Review on high heat flux flow boiling of refrigerants and water for electronics cooling

Heat removal from high heat flux devices such as computer chips, laser diodes, and other electronic devices and components has been a significant issue with the advances in micro- and nanofabrication capabilities. High heat fluxes suggest phase-change heat transfer modes including flow boiling to ac...

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Veröffentlicht in:	International journal of heat and mass transfer 2021-12, Vol.180, p.121787, Article 121787
Hauptverfasser:	Parizad Benam, Behnam, Sadaghiani, Abdolali Khalili, Yağcı, Vedat, Parlak, Murat, Sefiane, Khellil, Koşar, Ali
Format:	Artikel
Sprache:	eng
Schlagworte:	Cooling systems Critical heat flux (CHF) Electronic devices Enhancement methods Flow boiling Heat flux Heat transfer Heat transfer coefficient (HTC) High heat flux cooling Nanofabrication Pressure drop Refrigerants Semiconductor lasers Working fluids
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