Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction
Alloying various elements into the solders or the Cu substrate has been conducted to prevent embrittlement of Sn–Bi/Cu solder joints, caused by Bi segregation and growth of Kirkendall voids, via changes in the intermetallic compounds (IMCs) and interfacial microstructure of the solder joints. In thi...
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| Veröffentlicht in: | Journal of materials science. Materials in electronics 2021-12, Vol.32 (24), p.28346-28357 |
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| container_title | Journal of materials science. Materials in electronics |
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| creator | Park, Dae-Young Kim, Jungsoo Yu, Dong-Yurl Yoo, Sehoon Park, Hyun-Soon Sohn, Yoonchul Ko, Yong-Ho |
| description | Alloying various elements into the solders or the Cu substrate has been conducted to prevent embrittlement of Sn–Bi/Cu solder joints, caused by Bi segregation and growth of Kirkendall voids, via changes in the intermetallic compounds (IMCs) and interfacial microstructure of the solder joints. In this study, reactions between Cu and Sn–58Bi alloyed with Ag nanoparticles (NPs) were investigated by varying number of reflow. Even after 9 times of reflow, formation of Cu
3
Sn and Kirkendall void was not much observed at the interface, contrary to what is expected in Sn–58Bi/Cu solder joints after solid-state aging. The experimental results revealed that alloying a large amount of Ag was not helpful to strengthening the solder joint, whereas small addition of Ag NPs (0.5 wt.%) effectively improved the mechanical reliability via refinement of the eutectic microstructure of Sn–58Bi solder and suppression of growth of the Cu
6
Sn
5
grains at the interface. With increasing amount of Ag NPs, shear strength decreased because of increase and coarsening of Ag
3
Sn particles and formation of weak interfaces of solder/Ag
3
Sn and Ag
3
Sn/Cu
6
Sn
5
, where brittle fracture was observed. For liquid-state reaction, addition of a small amount of Ag into Sn–58Bi solder was successful to enhance mechanical reliability without formation of Kirkendall voids at the reaction interface. |
| doi_str_mv | 10.1007/s10854-021-07210-9 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_sprin</sourceid><recordid>TN_cdi_proquest_journals_2597615746</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2597615746</sourcerecordid><originalsourceid>FETCH-LOGICAL-c319t-94de743b3de25272ebc0d3b16ad5f2af39c836cff2d6bf08f169b2cfb9f97e9c3</originalsourceid><addsrcrecordid>eNqNkM1qFTEUx4MoeG19AVcBlxKbj_nKsg5WCxUXVXAXMslJzWVuMk0yFBeC7-Ab9knMdUR30tUJh__vnJwfQi8Yfc0o7c8yo0PbEMoZoT1nlMhHaMfaXpBm4F8eox2VbU-alvOn6FnOe0pp14hhh75_8CbFXNJqypoA62DxAcxXHbzRM15SXCAVDxlHh89vcNAhLrp2zAyZHKL1zoPF1-H-x892eOPPxhXnOFtIeB99KBnbNflwg2d_u3pLctEFcAJtio_hFD1xes7w_E89QZ8v3n4a35Orj-8ux_MrYgSThcjGQt-ISVjgLe85TIZaMbFO29Zx7YQ0g-iMc9x2k6ODY52cuHGTdLIHacQJernNrffcrpCL2sc1hbpS8Vb2XTXVdDXFt9TRSE7g1JL8QadvilF11Kw2zapqVr81K1mhVxt0B1N02XgIBv6C1XN_JIehviiv6eHh6dFXWdXSGNdQKio2NC9HoZD-3fCf7_0CLsOk3A</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2597615746</pqid></control><display><type>article</type><title>Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction</title><source>SpringerNature Journals</source><source>Web of Science - Science Citation Index Expanded - 2021<img src="https://exlibris-pub.s3.amazonaws.com/fromwos-v2.jpg" /></source><creator>Park, Dae-Young ; Kim, Jungsoo ; Yu, Dong-Yurl ; Yoo, Sehoon ; Park, Hyun-Soon ; Sohn, Yoonchul ; Ko, Yong-Ho</creator><creatorcontrib>Park, Dae-Young ; Kim, Jungsoo ; Yu, Dong-Yurl ; Yoo, Sehoon ; Park, Hyun-Soon ; Sohn, Yoonchul ; Ko, Yong-Ho</creatorcontrib><description>Alloying various elements into the solders or the Cu substrate has been conducted to prevent embrittlement of Sn–Bi/Cu solder joints, caused by Bi segregation and growth of Kirkendall voids, via changes in the intermetallic compounds (IMCs) and interfacial microstructure of the solder joints. In this study, reactions between Cu and Sn–58Bi alloyed with Ag nanoparticles (NPs) were investigated by varying number of reflow. Even after 9 times of reflow, formation of Cu
3
Sn and Kirkendall void was not much observed at the interface, contrary to what is expected in Sn–58Bi/Cu solder joints after solid-state aging. The experimental results revealed that alloying a large amount of Ag was not helpful to strengthening the solder joint, whereas small addition of Ag NPs (0.5 wt.%) effectively improved the mechanical reliability via refinement of the eutectic microstructure of Sn–58Bi solder and suppression of growth of the Cu
6
Sn
5
grains at the interface. With increasing amount of Ag NPs, shear strength decreased because of increase and coarsening of Ag
3
Sn particles and formation of weak interfaces of solder/Ag
3
Sn and Ag
3
Sn/Cu
6
Sn
5
, where brittle fracture was observed. For liquid-state reaction, addition of a small amount of Ag into Sn–58Bi solder was successful to enhance mechanical reliability without formation of Kirkendall voids at the reaction interface.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1007/s10854-021-07210-9</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Aging (metallurgy) ; Alloying elements ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Copper ; Engineering ; Engineering, Electrical & Electronic ; Interfaces ; Intermetallic compounds ; Materials Science ; Materials Science, Multidisciplinary ; Mechanical properties ; Microstructure ; Nanoparticles ; Optical and Electronic Materials ; Physical Sciences ; Physics ; Physics, Applied ; Physics, Condensed Matter ; Reliability ; Science & Technology ; Shear strength ; Silver ; Soldered joints ; Solders ; Substrates ; Technology ; Tin</subject><ispartof>Journal of materials science. Materials in electronics, 2021-12, Vol.32 (24), p.28346-28357</ispartof><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2021</rights><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2021.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>true</woscitedreferencessubscribed><woscitedreferencescount>2</woscitedreferencescount><woscitedreferencesoriginalsourcerecordid>wos000710078800002</woscitedreferencesoriginalsourcerecordid><citedby>FETCH-LOGICAL-c319t-94de743b3de25272ebc0d3b16ad5f2af39c836cff2d6bf08f169b2cfb9f97e9c3</citedby><cites>FETCH-LOGICAL-c319t-94de743b3de25272ebc0d3b16ad5f2af39c836cff2d6bf08f169b2cfb9f97e9c3</cites><orcidid>0000-0002-1619-8467</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10854-021-07210-9$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10854-021-07210-9$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>315,781,785,27929,27930,39263,41493,42562,51324</link.rule.ids></links><search><creatorcontrib>Park, Dae-Young</creatorcontrib><creatorcontrib>Kim, Jungsoo</creatorcontrib><creatorcontrib>Yu, Dong-Yurl</creatorcontrib><creatorcontrib>Yoo, Sehoon</creatorcontrib><creatorcontrib>Park, Hyun-Soon</creatorcontrib><creatorcontrib>Sohn, Yoonchul</creatorcontrib><creatorcontrib>Ko, Yong-Ho</creatorcontrib><title>Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction</title><title>Journal of materials science. Materials in electronics</title><addtitle>J Mater Sci: Mater Electron</addtitle><addtitle>J MATER SCI-MATER EL</addtitle><description>Alloying various elements into the solders or the Cu substrate has been conducted to prevent embrittlement of Sn–Bi/Cu solder joints, caused by Bi segregation and growth of Kirkendall voids, via changes in the intermetallic compounds (IMCs) and interfacial microstructure of the solder joints. In this study, reactions between Cu and Sn–58Bi alloyed with Ag nanoparticles (NPs) were investigated by varying number of reflow. Even after 9 times of reflow, formation of Cu
3
Sn and Kirkendall void was not much observed at the interface, contrary to what is expected in Sn–58Bi/Cu solder joints after solid-state aging. The experimental results revealed that alloying a large amount of Ag was not helpful to strengthening the solder joint, whereas small addition of Ag NPs (0.5 wt.%) effectively improved the mechanical reliability via refinement of the eutectic microstructure of Sn–58Bi solder and suppression of growth of the Cu
6
Sn
5
grains at the interface. With increasing amount of Ag NPs, shear strength decreased because of increase and coarsening of Ag
3
Sn particles and formation of weak interfaces of solder/Ag
3
Sn and Ag
3
Sn/Cu
6
Sn
5
, where brittle fracture was observed. For liquid-state reaction, addition of a small amount of Ag into Sn–58Bi solder was successful to enhance mechanical reliability without formation of Kirkendall voids at the reaction interface.</description><subject>Aging (metallurgy)</subject><subject>Alloying elements</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Engineering</subject><subject>Engineering, Electrical & Electronic</subject><subject>Interfaces</subject><subject>Intermetallic compounds</subject><subject>Materials Science</subject><subject>Materials Science, Multidisciplinary</subject><subject>Mechanical properties</subject><subject>Microstructure</subject><subject>Nanoparticles</subject><subject>Optical and Electronic Materials</subject><subject>Physical Sciences</subject><subject>Physics</subject><subject>Physics, Applied</subject><subject>Physics, Condensed Matter</subject><subject>Reliability</subject><subject>Science & Technology</subject><subject>Shear strength</subject><subject>Silver</subject><subject>Soldered joints</subject><subject>Solders</subject><subject>Substrates</subject><subject>Technology</subject><subject>Tin</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>HGBXW</sourceid><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNqNkM1qFTEUx4MoeG19AVcBlxKbj_nKsg5WCxUXVXAXMslJzWVuMk0yFBeC7-Ab9knMdUR30tUJh__vnJwfQi8Yfc0o7c8yo0PbEMoZoT1nlMhHaMfaXpBm4F8eox2VbU-alvOn6FnOe0pp14hhh75_8CbFXNJqypoA62DxAcxXHbzRM15SXCAVDxlHh89vcNAhLrp2zAyZHKL1zoPF1-H-x892eOPPxhXnOFtIeB99KBnbNflwg2d_u3pLctEFcAJtio_hFD1xes7w_E89QZ8v3n4a35Orj-8ux_MrYgSThcjGQt-ISVjgLe85TIZaMbFO29Zx7YQ0g-iMc9x2k6ODY52cuHGTdLIHacQJernNrffcrpCL2sc1hbpS8Vb2XTXVdDXFt9TRSE7g1JL8QadvilF11Kw2zapqVr81K1mhVxt0B1N02XgIBv6C1XN_JIehviiv6eHh6dFXWdXSGNdQKio2NC9HoZD-3fCf7_0CLsOk3A</recordid><startdate>20211201</startdate><enddate>20211201</enddate><creator>Park, Dae-Young</creator><creator>Kim, Jungsoo</creator><creator>Yu, Dong-Yurl</creator><creator>Yoo, Sehoon</creator><creator>Park, Hyun-Soon</creator><creator>Sohn, Yoonchul</creator><creator>Ko, Yong-Ho</creator><general>Springer US</general><general>Springer Nature</general><general>Springer Nature B.V</general><scope>BLEPL</scope><scope>DTL</scope><scope>HGBXW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>S0W</scope><orcidid>https://orcid.org/0000-0002-1619-8467</orcidid></search><sort><creationdate>20211201</creationdate><title>Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction</title><author>Park, Dae-Young ; Kim, Jungsoo ; Yu, Dong-Yurl ; Yoo, Sehoon ; Park, Hyun-Soon ; Sohn, Yoonchul ; Ko, Yong-Ho</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-94de743b3de25272ebc0d3b16ad5f2af39c836cff2d6bf08f169b2cfb9f97e9c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Aging (metallurgy)</topic><topic>Alloying elements</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Engineering</topic><topic>Engineering, Electrical & Electronic</topic><topic>Interfaces</topic><topic>Intermetallic compounds</topic><topic>Materials Science</topic><topic>Materials Science, Multidisciplinary</topic><topic>Mechanical properties</topic><topic>Microstructure</topic><topic>Nanoparticles</topic><topic>Optical and Electronic Materials</topic><topic>Physical Sciences</topic><topic>Physics</topic><topic>Physics, Applied</topic><topic>Physics, Condensed Matter</topic><topic>Reliability</topic><topic>Science & Technology</topic><topic>Shear strength</topic><topic>Silver</topic><topic>Soldered joints</topic><topic>Solders</topic><topic>Substrates</topic><topic>Technology</topic><topic>Tin</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Park, Dae-Young</creatorcontrib><creatorcontrib>Kim, Jungsoo</creatorcontrib><creatorcontrib>Yu, Dong-Yurl</creatorcontrib><creatorcontrib>Yoo, Sehoon</creatorcontrib><creatorcontrib>Park, Hyun-Soon</creatorcontrib><creatorcontrib>Sohn, Yoonchul</creatorcontrib><creatorcontrib>Ko, Yong-Ho</creatorcontrib><collection>Web of Science Core Collection</collection><collection>Science Citation Index Expanded</collection><collection>Web of Science - Science Citation Index Expanded - 2021</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>Proquest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>DELNET Engineering & Technology Collection</collection><jtitle>Journal of materials science. Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Park, Dae-Young</au><au>Kim, Jungsoo</au><au>Yu, Dong-Yurl</au><au>Yoo, Sehoon</au><au>Park, Hyun-Soon</au><au>Sohn, Yoonchul</au><au>Ko, Yong-Ho</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction</atitle><jtitle>Journal of materials science. Materials in electronics</jtitle><stitle>J Mater Sci: Mater Electron</stitle><stitle>J MATER SCI-MATER EL</stitle><date>2021-12-01</date><risdate>2021</risdate><volume>32</volume><issue>24</issue><spage>28346</spage><epage>28357</epage><pages>28346-28357</pages><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>Alloying various elements into the solders or the Cu substrate has been conducted to prevent embrittlement of Sn–Bi/Cu solder joints, caused by Bi segregation and growth of Kirkendall voids, via changes in the intermetallic compounds (IMCs) and interfacial microstructure of the solder joints. In this study, reactions between Cu and Sn–58Bi alloyed with Ag nanoparticles (NPs) were investigated by varying number of reflow. Even after 9 times of reflow, formation of Cu
3
Sn and Kirkendall void was not much observed at the interface, contrary to what is expected in Sn–58Bi/Cu solder joints after solid-state aging. The experimental results revealed that alloying a large amount of Ag was not helpful to strengthening the solder joint, whereas small addition of Ag NPs (0.5 wt.%) effectively improved the mechanical reliability via refinement of the eutectic microstructure of Sn–58Bi solder and suppression of growth of the Cu
6
Sn
5
grains at the interface. With increasing amount of Ag NPs, shear strength decreased because of increase and coarsening of Ag
3
Sn particles and formation of weak interfaces of solder/Ag
3
Sn and Ag
3
Sn/Cu
6
Sn
5
, where brittle fracture was observed. For liquid-state reaction, addition of a small amount of Ag into Sn–58Bi solder was successful to enhance mechanical reliability without formation of Kirkendall voids at the reaction interface.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10854-021-07210-9</doi><tpages>12</tpages><orcidid>https://orcid.org/0000-0002-1619-8467</orcidid></addata></record> |
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| source | SpringerNature Journals; Web of Science - Science Citation Index Expanded - 2021<img src="https://exlibris-pub.s3.amazonaws.com/fromwos-v2.jpg" /> |
| subjects | Aging (metallurgy) Alloying elements Characterization and Evaluation of Materials Chemistry and Materials Science Copper Engineering Engineering, Electrical & Electronic Interfaces Intermetallic compounds Materials Science Materials Science, Multidisciplinary Mechanical properties Microstructure Nanoparticles Optical and Electronic Materials Physical Sciences Physics Physics, Applied Physics, Condensed Matter Reliability Science & Technology Shear strength Silver Soldered joints Solders Substrates Technology Tin |
| title | Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-14T23%3A25%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_sprin&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Microstructure%20and%20mechanical%20properties%20of%20Ag%20nanoparticles-modified%20Sn%E2%80%9358Bi/Cu%20solder%20joints%20during%20liquid-state%20reaction&rft.jtitle=Journal%20of%20materials%20science.%20Materials%20in%20electronics&rft.au=Park,%20Dae-Young&rft.date=2021-12-01&rft.volume=32&rft.issue=24&rft.spage=28346&rft.epage=28357&rft.pages=28346-28357&rft.issn=0957-4522&rft.eissn=1573-482X&rft_id=info:doi/10.1007/s10854-021-07210-9&rft_dat=%3Cproquest_sprin%3E2597615746%3C/proquest_sprin%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2597615746&rft_id=info:pmid/&rfr_iscdi=true |