Reduction process of copper oxide film by formic acid

The reduction of a copper oxide surface film by formic acid was investigated in situ using a spectroscopic ellipsometer. The activation energy of the reduction of the copper oxide film by formic acid was 97.4 kJ mol−1, and the reduction rate increased with increasing formic acid partial pressure. Fr...

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Veröffentlicht in:	Japanese Journal of Applied Physics 2021-11, Vol.60 (11), p.115502
Hauptverfasser:	Ozawa, Naoto, Shibata, Masami
Format:	Artikel
Sprache:	eng
Schlagworte:	Acids Copper Copper oxide Copper oxides Diffusion Ellipsometory Formic acid Fromic acid Hydrogen atoms in-situ Magnetism Oxide coatings Oxygen atoms Partial pressure Reduction
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