Preparation, dielectric and thermomechanical properties of a novel epoxy resin system cured at room temperature

A new kind of bisphenol A-type epoxy resin (E51) system cured at room temperature was prepared using ether bond- and fluorine-containing aromatic diamine, including 4,4′-(Hexafluoroisopropylidene)bis(p-phenyleneoxy)dianiline (HFBAPP) and 2,2-Bis[4-(4-aminophenoxy)phenyl]propane (BAPP), and acrylic a...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2021-10, Vol.32 (20), p.24902-24909
Hauptverfasser:	Yuan, Zhigang, Wang, Ting, Cai, Wanan, Pan, Zhongcheng, Wang, Jun, Derradji, Mehdi, Liu, Wen-bin
Format:	Artikel
Sprache:	eng
Schlagworte:	Acrylic acid Acrylic resins Bisphenol A Characterization and Evaluation of Materials Chemistry and Materials Science Curing Diamines Dielectric loss Dielectric properties Dielectric strength Dynamic mechanical analysis Epoxy resins Fluorine Glass transition temperature Hardeners Materials Science Morphology Network analysers Optical and Electronic Materials Rapid prototyping Room temperature Scanning electron microscopy Storage modulus Tensile properties Tensile strength Tensile tests Thermal stability Thermodynamic properties Thermogravimetric analysis Thermomechanical properties
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