The optimized interface characteristics of β-Ga2O3 Schottky barrier diode with low temperature annealing

A low temperature controlled annealing technique was utilized to improve the performance of vertical β-gallium oxide (β-Ga2O3) Schottky barrier diodes (SBDs) in this work. The nickel is diffused into Ga2O3, and NiO was formed at the interface between the anode and semiconductor generating p–n junction after low temperature annealing. Simultaneously, the trap state density of interface Ni/Ga2O3 as well as the carbon bonded with oxygen on the surface was reduced, which was proved by the capacitance and conductance measurements and x-ray photoelectron spectroscopic analysis, respectively. Combined the decreased saturation current density by three orders of magnitude from 1.21 × 10−6 to 9.27 × 10−8 and 5.12 × 10−9 A/cm2 and larger breakdown voltage from 220 to 270 V owing to the optimized interface and the formation of NiO, a low temperature annealing technique makes certain effective improvement for vertical β-Ga2O3 SBDs via interface engineering.