Effect of temperature on ductile-to-brittle transition in diamond cutting of silicon

Ultra-precision machining of single-crystal silicon can be realized by applying single-point diamond turning with micro-laser-assisted machining technology, through which the ductility of silicon can be enhanced. However, it is difficult to explain the role of temperature accurately in such technolo...

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Veröffentlicht in:	International journal of advanced manufacturing technology 2021-10, Vol.116 (11-12), p.3447-3462
Hauptverfasser:	He, Wenbin, Liu, Changlin, Xu, Guoqing, Zhang, Jianguo, Xiao, Junfeng, Chen, Xiao, Xu, Jianfeng
Format:	Artikel
Sprache:	eng
Schlagworte:	Accuracy Algorithms Brittleness CAE) and Design Computer simulation Computer-Aided Engineering (CAD Cutting force Cutting parameters Diamond machining Ductile-brittle transition Engineering Finite element method Fluid flow Grooving Industrial and Production Engineering Mathematical models Measurement methods Mechanical Engineering Media Management Microlasers Optimization Original Article Precision machining Process parameters Silicon Simulation Single crystals Smooth particle hydrodynamics Temperature distribution Temperature effects Turning (machining)
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