Welding defect signal extraction technology based on OMP algorithm

Flip-chip technology has been rapidly developed and widely used in the field of microelectronic packaging, and defect detection has also received increasing attention. In the experiment, ultrasonic testing was used to detect defects on flip chip. Aiming at the problem that the interference noise of...

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Veröffentlicht in:	Journal of physics. Conference series 2019-04, Vol.1187 (4), p.42098
Hauptverfasser:	Ailing, Qi, Haijun, Lei
Format:	Artikel
Sprache:	eng
Schlagworte:	Algorithms Background noise Electronic packaging Matched pursuit Matching Ultrasonic testing Weld defects
Online-Zugang:	Volltext
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