Molecular dynamics simulation of the nano- reinforced lead-free solder at different reflow soldering process temperature

Temperature plays an important role in the reflow soldering process. Reflow soldering process which involving four basic stages including preheating, soaking, reflow and cooling require a specific range of temperature at each stage and the highest temperature is the reflow stage. In this study, the...

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Veröffentlicht in:	IOP conference series. Materials Science and Engineering 2019-12, Vol.701 (1), p.12014
Hauptverfasser:	Sahrudin, Intan Norshalina, Aziz, Mohd Shahrizal Abdul, Abdullah, Mohd Zulkifly, Salleh, Mohd Arif Anuar Mohd
Format:	Artikel
Sprache:	eng
Schlagworte:	Heating Lead free Molecular dynamics Nanoparticles Reflow soldering Room temperature Simulation Solders Temperature Tin
Online-Zugang:	Volltext
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