Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling
An implicit integration scheme was developed for simulating the viscoplastic constitutive behavior of Sn3.0Ag0.5Cu solder and programmed into a user material subroutine of the finite element software ANSYS. The numerical procedure first solves the essential state variables by using a three-level ite...
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| Veröffentlicht in: | Computer modeling in engineering & sciences 2021-01, Vol.128 (2), p.639-668 |
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| creator | Yang, Hung-Chun Chiu, Tz-Cheng |
| description | An implicit integration scheme was developed for simulating the viscoplastic constitutive behavior of Sn3.0Ag0.5Cu solder and programmed into a user material subroutine of the finite element software ANSYS. The numerical procedure first solves the essential state variables by using
a three-level iterative procedure, and updates the remaining stress and state variables accordingly. The numerical implementation was applied to consider the responses of solder joints in an electronic assembly under temperature cycling condition. The viscoplastic strain energy density accumulation
over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the solder joints. |
| doi_str_mv | 10.32604/cmes.2021.016159 |
| format | Article |
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a three-level iterative procedure, and updates the remaining stress and state variables accordingly. The numerical implementation was applied to consider the responses of solder joints in an electronic assembly under temperature cycling condition. The viscoplastic strain energy density accumulation
over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the solder joints.</description><identifier>ISSN: 1526-1492</identifier><identifier>ISSN: 1526-1506</identifier><identifier>EISSN: 1526-1506</identifier><identifier>DOI: 10.32604/cmes.2021.016159</identifier><language>eng</language><publisher>Henderson: Tech Science Press</publisher><subject>Cycles ; Electronic assemblies ; Equilibrium ; Fatigue ; Finite element method ; Flux density ; Hysteresis ; Iterative methods ; Kinematics ; Parameter identification ; Pb-Free ; Ratcheting ; Reliability analysis ; Soldered joints ; Solders ; State variable ; Strain hardening ; Tangent Modulus ; Variables</subject><ispartof>Computer modeling in engineering & sciences, 2021-01, Vol.128 (2), p.639-668</ispartof><rights>2021. This work is licensed under https://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c373t-fcb7bac4cc1493faac3c0245642aaf1c1222226075036e553ec7c7270003e1ee3</citedby><cites>FETCH-LOGICAL-c373t-fcb7bac4cc1493faac3c0245642aaf1c1222226075036e553ec7c7270003e1ee3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902</link.rule.ids></links><search><creatorcontrib>Yang, Hung-Chun</creatorcontrib><creatorcontrib>Chiu, Tz-Cheng</creatorcontrib><title>Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling</title><title>Computer modeling in engineering & sciences</title><description>An implicit integration scheme was developed for simulating the viscoplastic constitutive behavior of Sn3.0Ag0.5Cu solder and programmed into a user material subroutine of the finite element software ANSYS. The numerical procedure first solves the essential state variables by using
a three-level iterative procedure, and updates the remaining stress and state variables accordingly. The numerical implementation was applied to consider the responses of solder joints in an electronic assembly under temperature cycling condition. The viscoplastic strain energy density accumulation
over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the solder joints.</description><subject>Cycles</subject><subject>Electronic assemblies</subject><subject>Equilibrium</subject><subject>Fatigue</subject><subject>Finite element method</subject><subject>Flux density</subject><subject>Hysteresis</subject><subject>Iterative methods</subject><subject>Kinematics</subject><subject>Parameter identification</subject><subject>Pb-Free</subject><subject>Ratcheting</subject><subject>Reliability analysis</subject><subject>Soldered joints</subject><subject>Solders</subject><subject>State variable</subject><subject>Strain hardening</subject><subject>Tangent Modulus</subject><subject>Variables</subject><issn>1526-1492</issn><issn>1526-1506</issn><issn>1526-1506</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNpNUMtOwzAQjBBIQOEDuFninOJHnLQ3oOJRVECClqvlOmvkKomD7SD1zofjNCDYy452Z3Y1kyRnBI8ZzXF2oWrwY4opGWOSEz7dS44Ip3lKOM73f3E2pYfJsfcbjFnOJtOj5Oupq8EZJSs0r9sKamiCDMY2yGok0aox2kCJ3oxXtq2kD0ahR1tChbR1aGYbb8qob97Rq60iQg_WNAG9gG_jDlDX9MNrK12ZLuAz6pZQt-Bk6Byg2VZVUXuSHGhZeTj96aNkdXuznN2ni-e7-exqkSpWsJBqtS7WUmVKRSNMS6mYwjTjeUal1EQR2leOCx7dAecMVKEKWuDoFggAGyXnw93W2Y8OfBAb27kmvhSU84JklOAissjAUs5670CL1plauq0gWOzCFn3Yog9bDGFHzeWgiW76BP8OB9_-p_dF6GQAGFMhXdiN2DfIhYjf</recordid><startdate>20210101</startdate><enddate>20210101</enddate><creator>Yang, Hung-Chun</creator><creator>Chiu, Tz-Cheng</creator><general>Tech Science Press</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7TB</scope><scope>8FD</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>FR3</scope><scope>JQ2</scope><scope>KR7</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope></search><sort><creationdate>20210101</creationdate><title>Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling</title><author>Yang, Hung-Chun ; 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The numerical procedure first solves the essential state variables by using
a three-level iterative procedure, and updates the remaining stress and state variables accordingly. The numerical implementation was applied to consider the responses of solder joints in an electronic assembly under temperature cycling condition. The viscoplastic strain energy density accumulation
over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the solder joints.</abstract><cop>Henderson</cop><pub>Tech Science Press</pub><doi>10.32604/cmes.2021.016159</doi><tpages>30</tpages><oa>free_for_read</oa></addata></record> |
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| source | Tech Science Press; EZB-FREE-00999 freely available EZB journals |
| subjects | Cycles Electronic assemblies Equilibrium Fatigue Finite element method Flux density Hysteresis Iterative methods Kinematics Parameter identification Pb-Free Ratcheting Reliability analysis Soldered joints Solders State variable Strain hardening Tangent Modulus Variables |
| title | Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling |
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