Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure
As electronic devices tend to be integrated and high-powered, thermal conductivity is regarded as the crucial parameter of electronic components, which has become the main factor that limits the operating speed and service lifetime of electronic devices. However, constructing continuous thermal cond...
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Veröffentlicht in: | RSC advances 2021-07, Vol.11 (41), p.25422-2543 |
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Format: | Artikel |
Sprache: | eng |
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