Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints
Purpose This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times. Design/methodology/approach Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu...
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| Veröffentlicht in: | Soldering & surface mount technology 2021-07, Vol.33 (4), p.206-214 |
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| container_title | Soldering & surface mount technology |
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| creator | Han, Xu Li, Xiaoyan Yao, Peng Chen, Dalong |
| description | Purpose
This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.
Design/methodology/approach
Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid–liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 μm.
Findings
Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s.
Originality/value
The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process. |
| doi_str_mv | 10.1108/SSMT-06-2020-0026 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_emera</sourceid><recordid>TN_cdi_proquest_journals_2549563184</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2549563184</sourcerecordid><originalsourceid>FETCH-LOGICAL-c314t-ff00ce171a8403b5b95120dade2360dee0cf4728eecc2e199cde87538caf74613</originalsourceid><addsrcrecordid>eNptkD1PwzAQQC0EEqXwA9giMRvOH3GcEVV8VCowpMyW65ylVGlc7Hjg35OoLEhMt7x3d3qE3DK4Zwz0Q9O8bSkoyoEDBeDqjCxYVWqqtFDnZAF1KSnUjF2Sq5T2ACBVLRbkfT34PuPgsAi-yP0YbQp5aFMRhqIbRozeus72xaFzMaQxZjfmiGmmV5k2Q5FC32Is9mGi0zW58LZPePM7l-Tz-Wm7eqWbj5f16nFDnWBypN4DOGQVs1qC2JW7umQcWtsiFwpaRHBeVlwjOseR1bVrUVel0M76SiomluTutPcYw1fGNJp9yHGYThpeyrpUgmk5UexEza-niN4cY3ew8dswMHM2M2czoMyczczZJgdODh4w2r79V_lTWvwARbNvqA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2549563184</pqid></control><display><type>article</type><title>Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints</title><source>Emerald A-Z Current Journals</source><creator>Han, Xu ; Li, Xiaoyan ; Yao, Peng ; Chen, Dalong</creator><creatorcontrib>Han, Xu ; Li, Xiaoyan ; Yao, Peng ; Chen, Dalong</creatorcontrib><description>Purpose
This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.
Design/methodology/approach
Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid–liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 μm.
Findings
Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s.
Originality/value
The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.</description><identifier>ISSN: 0954-0911</identifier><identifier>EISSN: 1758-6836</identifier><identifier>EISSN: 0954-0911</identifier><identifier>DOI: 10.1108/SSMT-06-2020-0026</identifier><language>eng</language><publisher>Bradford: Emerald Publishing Limited</publisher><subject>Chemical reactions ; Cooling ; Copper ; Interfaces ; Investigations ; Morphology ; Nucleation ; Shock waves ; Soldered joints ; Soldering ; Solders ; Temperature ; Tin ; Ultrasonic imaging ; Ultrasonic processing</subject><ispartof>Soldering & surface mount technology, 2021-07, Vol.33 (4), p.206-214</ispartof><rights>Emerald Publishing Limited</rights><rights>Emerald Publishing Limited 2020</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c314t-ff00ce171a8403b5b95120dade2360dee0cf4728eecc2e199cde87538caf74613</citedby><cites>FETCH-LOGICAL-c314t-ff00ce171a8403b5b95120dade2360dee0cf4728eecc2e199cde87538caf74613</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/SSMT-06-2020-0026/full/html$$EHTML$$P50$$Gemerald$$H</linktohtml><link.rule.ids>314,780,784,967,11635,27924,27925,52689</link.rule.ids></links><search><creatorcontrib>Han, Xu</creatorcontrib><creatorcontrib>Li, Xiaoyan</creatorcontrib><creatorcontrib>Yao, Peng</creatorcontrib><creatorcontrib>Chen, Dalong</creatorcontrib><title>Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints</title><title>Soldering & surface mount technology</title><description>Purpose
This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.
Design/methodology/approach
Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid–liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 μm.
Findings
Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s.
Originality/value
The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.</description><subject>Chemical reactions</subject><subject>Cooling</subject><subject>Copper</subject><subject>Interfaces</subject><subject>Investigations</subject><subject>Morphology</subject><subject>Nucleation</subject><subject>Shock waves</subject><subject>Soldered joints</subject><subject>Soldering</subject><subject>Solders</subject><subject>Temperature</subject><subject>Tin</subject><subject>Ultrasonic imaging</subject><subject>Ultrasonic processing</subject><issn>0954-0911</issn><issn>1758-6836</issn><issn>0954-0911</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNptkD1PwzAQQC0EEqXwA9giMRvOH3GcEVV8VCowpMyW65ylVGlc7Hjg35OoLEhMt7x3d3qE3DK4Zwz0Q9O8bSkoyoEDBeDqjCxYVWqqtFDnZAF1KSnUjF2Sq5T2ACBVLRbkfT34PuPgsAi-yP0YbQp5aFMRhqIbRozeus72xaFzMaQxZjfmiGmmV5k2Q5FC32Is9mGi0zW58LZPePM7l-Tz-Wm7eqWbj5f16nFDnWBypN4DOGQVs1qC2JW7umQcWtsiFwpaRHBeVlwjOseR1bVrUVel0M76SiomluTutPcYw1fGNJp9yHGYThpeyrpUgmk5UexEza-niN4cY3ew8dswMHM2M2czoMyczczZJgdODh4w2r79V_lTWvwARbNvqA</recordid><startdate>20210712</startdate><enddate>20210712</enddate><creator>Han, Xu</creator><creator>Li, Xiaoyan</creator><creator>Yao, Peng</creator><creator>Chen, Dalong</creator><general>Emerald Publishing Limited</general><general>Emerald Group Publishing Limited</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7RQ</scope><scope>7SP</scope><scope>7TB</scope><scope>7WY</scope><scope>7XB</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>FR3</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K6~</scope><scope>KB.</scope><scope>KR7</scope><scope>L.-</scope><scope>L7M</scope><scope>M0F</scope><scope>M2P</scope><scope>PDBOC</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope></search><sort><creationdate>20210712</creationdate><title>Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints</title><author>Han, Xu ; Li, Xiaoyan ; Yao, Peng ; Chen, Dalong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c314t-ff00ce171a8403b5b95120dade2360dee0cf4728eecc2e199cde87538caf74613</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Chemical reactions</topic><topic>Cooling</topic><topic>Copper</topic><topic>Interfaces</topic><topic>Investigations</topic><topic>Morphology</topic><topic>Nucleation</topic><topic>Shock waves</topic><topic>Soldered joints</topic><topic>Soldering</topic><topic>Solders</topic><topic>Temperature</topic><topic>Tin</topic><topic>Ultrasonic imaging</topic><topic>Ultrasonic processing</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Han, Xu</creatorcontrib><creatorcontrib>Li, Xiaoyan</creatorcontrib><creatorcontrib>Yao, Peng</creatorcontrib><creatorcontrib>Chen, Dalong</creatorcontrib><collection>CrossRef</collection><collection>Career & Technical Education Database</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Access via ABI/INFORM (ProQuest)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>Engineering Research Database</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>Materials Science Database</collection><collection>Civil Engineering Abstracts</collection><collection>ABI/INFORM Professional Advanced</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM Trade & Industry</collection><collection>Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Business</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><jtitle>Soldering & surface mount technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Han, Xu</au><au>Li, Xiaoyan</au><au>Yao, Peng</au><au>Chen, Dalong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints</atitle><jtitle>Soldering & surface mount technology</jtitle><date>2021-07-12</date><risdate>2021</risdate><volume>33</volume><issue>4</issue><spage>206</spage><epage>214</epage><pages>206-214</pages><issn>0954-0911</issn><eissn>1758-6836</eissn><eissn>0954-0911</eissn><abstract>Purpose
This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times.
Design/methodology/approach
Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid–liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 μm.
Findings
Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s.
Originality/value
The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.</abstract><cop>Bradford</cop><pub>Emerald Publishing Limited</pub><doi>10.1108/SSMT-06-2020-0026</doi><tpages>9</tpages></addata></record> |
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| identifier | ISSN: 0954-0911 |
| ispartof | Soldering & surface mount technology, 2021-07, Vol.33 (4), p.206-214 |
| issn | 0954-0911 1758-6836 0954-0911 |
| language | eng |
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| source | Emerald A-Z Current Journals |
| subjects | Chemical reactions Cooling Copper Interfaces Investigations Morphology Nucleation Shock waves Soldered joints Soldering Solders Temperature Tin Ultrasonic imaging Ultrasonic processing |
| title | Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints |
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