Microscale mechanical properties dependent on the strain rate and temperature of cured isotropic conductive adhesive

In this research, the microscale strain rate sensitivity and high-temperature mechanical properties of cured isotropic conductive adhesive (ICA) were investigated using microindentation. The indentation modulus and hardness of cured ICA with high silver content are relatively large. The slopes of co...

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Veröffentlicht in:	Mechanics of time-dependent materials 2021-06, Vol.25 (2), p.249-264
Hauptverfasser:	Xiao, Gesheng, Li, Zhigang, Liu, Erqiang, Qiao, Li, Shu, Xuefeng, Sun, Ruijing
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Classical Mechanics Creep (materials) Engineering Hardness High temperature Mechanical properties Microhardness Modulus of elasticity Polymer Sciences Solid Mechanics Stiffness Strain rate sensitivity
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