Analysis of Scanning Acoustic Microscopy Problems for Plastic Encapsulated Microcircuits with Complex Structure

In order to keep up with the development trend of plastic encapsulated technology and effectively improve the Scanning Acoustic Microscopy (SAM) capability of Plastic Encapsulated Microcircuits (PEMs) with complex structure, the structural characteristics of complex packaging devices, the limitation...

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Veröffentlicht in:	Journal of physics. Conference series 2021-04, Vol.1885 (5), p.52054
Hauptverfasser:	Zhao, Hailong, Zhang, Kui, Zhou, Zhenhua, Xi, Shanbin, Ran, Honglei, Huang, Jie, Peng, Hao
Format:	Artikel
Sprache:	eng
Schlagworte:	Acoustic microscopes Encapsulated microcircuits Encapsulation Microscopy Physics Scanning acoustic microscopy Thickness Ultrasonic testing
Online-Zugang:	Volltext
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