Layered Semiconducting 2D Materials for Future Transistor Applications

Down‐scaling of transistor size in the lateral dimensions must be accompanied by a corresponding reduction in the channel thickness to ensure sufficient gate control to turn off the transistor. However, the carrier mobility of 3D bulk semiconductors degrades rapidly as the body thickness thins down...

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Veröffentlicht in:Small structures 2021-05, Vol.2 (5), p.n/a
Hauptverfasser: Su, Sheng-Kai, Chuu, Chih-Piao, Li, Ming-Yang, Cheng, Chao-Ching, Wong, H.-S. Philip, Li, Lain-Jong
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Sprache:eng
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