Effect of bonding time on the microstructure and shear property of Cu/SAC-15Ag/Cu 3D package solder joint fabricated by TLP
In this paper, Cu/SAC-15Ag/Cu 3D package solder joints were prepared by transient liquid phase (TLP) bonding technology. The effects of bonding time on the microstructure and shear property of solder joints were investigated. The results indicated that the microstructure of solder joints is coarsene...
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| Veröffentlicht in: | Journal of materials science. Materials in electronics 2021-04, Vol.32 (7), p.8387-8395 |
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| creator | Yang, Li Xu, Yuhang Zhang, Yaocheng Lu, Kaijian Qiao, Jian Yang, Yao Xu, Feng Gao, Huiming |
| description | In this paper, Cu/SAC-15Ag/Cu 3D package solder joints were prepared by transient liquid phase (TLP) bonding technology. The effects of bonding time on the microstructure and shear property of solder joints were investigated. The results indicated that the microstructure of solder joints is coarsened with increasing bonding time. The intermetallic compounds (IMCs) in the interfacial reaction zone consist of Cu
3
Sn and Cu
6
Sn
5
phase, and the IMCs in the in situ reaction zone include Ag
3
Sn phase, Sn-rich phase, and Ag particles. The thickness of interfacial IMCs layer initially decreases due to the volume contraction caused by the transformation from Cu
6
Sn
5
to Cu
3
Sn, and then increases as a result of the coarsen of Cu
3
Sn. The minimum porosity of the solder joints reaches 0.24% under bonding time of 30 min. The shear strength of solder joints increases first and then declines with the extension of bonding time, and the maximum shear strength of 45.3 MPa is obtained by bonding for 30 min. The shear fracture mechanism of solder joints changes from ductile fracture to ductile–brittle mixed fracture, and then changes to brittle fracture. Cracks nucleate at the voids and propagate quickly with prolonging bonding time, and the cracks could be restrained by the voids. |
| doi_str_mv | 10.1007/s10854-021-05434-3 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2515494868</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2515494868</sourcerecordid><originalsourceid>FETCH-LOGICAL-c319t-ac002ce934460fe54d74ec1e05c6cdabf7de933c26ce842ec5ffef7e6d0ba4d63</originalsourceid><addsrcrecordid>eNp9kEtLAzEUhYMoWKt_wFXAdWye81iWsT6goGAFdyGT3LRT25maZBbFP-_UCu5c3cU937n3HISuGb1llOaTyGihJKGcEaqkkEScoBFTuSCy4O-naERLlROpOD9HFzGuKaWZFMUIfc28B5tw53Hdta5plzg1W8Bdi9MK8LaxoYsp9Db1AbBpHY4rMAHvQreDkPYHsOonr9OKMDVdTqoeizu8M_bDLAHHbuMg4HXXtAl7U4fGmgQO13u8mL9cojNvNhGufucYvd3PFtUjmT8_PFXTObGClYkYSym3UAopM-pBSZdLsAyospl1pva5G5bC8sxCITlYNUTyOWSO1ka6TIzRzdF3ePqzh5j0uutDO5zUXDElS1lkxaDiR9UhcQzg9S40WxP2mlF9KFkfS9ZDyfqnZC0GSByhOIjbJYQ_63-ob4SAgBg</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2515494868</pqid></control><display><type>article</type><title>Effect of bonding time on the microstructure and shear property of Cu/SAC-15Ag/Cu 3D package solder joint fabricated by TLP</title><source>SpringerNature Journals</source><creator>Yang, Li ; Xu, Yuhang ; Zhang, Yaocheng ; Lu, Kaijian ; Qiao, Jian ; Yang, Yao ; Xu, Feng ; Gao, Huiming</creator><creatorcontrib>Yang, Li ; Xu, Yuhang ; Zhang, Yaocheng ; Lu, Kaijian ; Qiao, Jian ; Yang, Yao ; Xu, Feng ; Gao, Huiming</creatorcontrib><description>In this paper, Cu/SAC-15Ag/Cu 3D package solder joints were prepared by transient liquid phase (TLP) bonding technology. The effects of bonding time on the microstructure and shear property of solder joints were investigated. The results indicated that the microstructure of solder joints is coarsened with increasing bonding time. The intermetallic compounds (IMCs) in the interfacial reaction zone consist of Cu
3
Sn and Cu
6
Sn
5
phase, and the IMCs in the in situ reaction zone include Ag
3
Sn phase, Sn-rich phase, and Ag particles. The thickness of interfacial IMCs layer initially decreases due to the volume contraction caused by the transformation from Cu
6
Sn
5
to Cu
3
Sn, and then increases as a result of the coarsen of Cu
3
Sn. The minimum porosity of the solder joints reaches 0.24% under bonding time of 30 min. The shear strength of solder joints increases first and then declines with the extension of bonding time, and the maximum shear strength of 45.3 MPa is obtained by bonding for 30 min. The shear fracture mechanism of solder joints changes from ductile fracture to ductile–brittle mixed fracture, and then changes to brittle fracture. Cracks nucleate at the voids and propagate quickly with prolonging bonding time, and the cracks could be restrained by the voids.</description><identifier>ISSN: 0957-4522</identifier><identifier>EISSN: 1573-482X</identifier><identifier>DOI: 10.1007/s10854-021-05434-3</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Bonded joints ; Bonding strength ; Brittle fracture ; Characterization and Evaluation of Materials ; Chemical bonds ; Chemistry and Materials Science ; Copper ; Ductile fracture ; Ductile-brittle transition ; Fracture mechanics ; Heat treating ; Interface reactions ; Intermetallic compounds ; Liquid phases ; Materials Science ; Microstructure ; Optical and Electronic Materials ; Porosity ; Shear properties ; Shear strength ; Silver ; Soldered joints ; Solders ; Thickness ; Tin ; Transient liquid phase bonding</subject><ispartof>Journal of materials science. Materials in electronics, 2021-04, Vol.32 (7), p.8387-8395</ispartof><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2021</rights><rights>The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2021.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-ac002ce934460fe54d74ec1e05c6cdabf7de933c26ce842ec5ffef7e6d0ba4d63</citedby><cites>FETCH-LOGICAL-c319t-ac002ce934460fe54d74ec1e05c6cdabf7de933c26ce842ec5ffef7e6d0ba4d63</cites><orcidid>0000-0002-4234-785X</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10854-021-05434-3$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10854-021-05434-3$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Yang, Li</creatorcontrib><creatorcontrib>Xu, Yuhang</creatorcontrib><creatorcontrib>Zhang, Yaocheng</creatorcontrib><creatorcontrib>Lu, Kaijian</creatorcontrib><creatorcontrib>Qiao, Jian</creatorcontrib><creatorcontrib>Yang, Yao</creatorcontrib><creatorcontrib>Xu, Feng</creatorcontrib><creatorcontrib>Gao, Huiming</creatorcontrib><title>Effect of bonding time on the microstructure and shear property of Cu/SAC-15Ag/Cu 3D package solder joint fabricated by TLP</title><title>Journal of materials science. Materials in electronics</title><addtitle>J Mater Sci: Mater Electron</addtitle><description>In this paper, Cu/SAC-15Ag/Cu 3D package solder joints were prepared by transient liquid phase (TLP) bonding technology. The effects of bonding time on the microstructure and shear property of solder joints were investigated. The results indicated that the microstructure of solder joints is coarsened with increasing bonding time. The intermetallic compounds (IMCs) in the interfacial reaction zone consist of Cu
3
Sn and Cu
6
Sn
5
phase, and the IMCs in the in situ reaction zone include Ag
3
Sn phase, Sn-rich phase, and Ag particles. The thickness of interfacial IMCs layer initially decreases due to the volume contraction caused by the transformation from Cu
6
Sn
5
to Cu
3
Sn, and then increases as a result of the coarsen of Cu
3
Sn. The minimum porosity of the solder joints reaches 0.24% under bonding time of 30 min. The shear strength of solder joints increases first and then declines with the extension of bonding time, and the maximum shear strength of 45.3 MPa is obtained by bonding for 30 min. The shear fracture mechanism of solder joints changes from ductile fracture to ductile–brittle mixed fracture, and then changes to brittle fracture. Cracks nucleate at the voids and propagate quickly with prolonging bonding time, and the cracks could be restrained by the voids.</description><subject>Bonded joints</subject><subject>Bonding strength</subject><subject>Brittle fracture</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemical bonds</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Ductile fracture</subject><subject>Ductile-brittle transition</subject><subject>Fracture mechanics</subject><subject>Heat treating</subject><subject>Interface reactions</subject><subject>Intermetallic compounds</subject><subject>Liquid phases</subject><subject>Materials Science</subject><subject>Microstructure</subject><subject>Optical and Electronic Materials</subject><subject>Porosity</subject><subject>Shear properties</subject><subject>Shear strength</subject><subject>Silver</subject><subject>Soldered joints</subject><subject>Solders</subject><subject>Thickness</subject><subject>Tin</subject><subject>Transient liquid phase bonding</subject><issn>0957-4522</issn><issn>1573-482X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp9kEtLAzEUhYMoWKt_wFXAdWye81iWsT6goGAFdyGT3LRT25maZBbFP-_UCu5c3cU937n3HISuGb1llOaTyGihJKGcEaqkkEScoBFTuSCy4O-naERLlROpOD9HFzGuKaWZFMUIfc28B5tw53Hdta5plzg1W8Bdi9MK8LaxoYsp9Db1AbBpHY4rMAHvQreDkPYHsOonr9OKMDVdTqoeizu8M_bDLAHHbuMg4HXXtAl7U4fGmgQO13u8mL9cojNvNhGufucYvd3PFtUjmT8_PFXTObGClYkYSym3UAopM-pBSZdLsAyospl1pva5G5bC8sxCITlYNUTyOWSO1ka6TIzRzdF3ePqzh5j0uutDO5zUXDElS1lkxaDiR9UhcQzg9S40WxP2mlF9KFkfS9ZDyfqnZC0GSByhOIjbJYQ_63-ob4SAgBg</recordid><startdate>20210401</startdate><enddate>20210401</enddate><creator>Yang, Li</creator><creator>Xu, Yuhang</creator><creator>Zhang, Yaocheng</creator><creator>Lu, Kaijian</creator><creator>Qiao, Jian</creator><creator>Yang, Yao</creator><creator>Xu, Feng</creator><creator>Gao, Huiming</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>L7M</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>S0W</scope><orcidid>https://orcid.org/0000-0002-4234-785X</orcidid></search><sort><creationdate>20210401</creationdate><title>Effect of bonding time on the microstructure and shear property of Cu/SAC-15Ag/Cu 3D package solder joint fabricated by TLP</title><author>Yang, Li ; Xu, Yuhang ; Zhang, Yaocheng ; Lu, Kaijian ; Qiao, Jian ; Yang, Yao ; Xu, Feng ; Gao, Huiming</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-ac002ce934460fe54d74ec1e05c6cdabf7de933c26ce842ec5ffef7e6d0ba4d63</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Bonded joints</topic><topic>Bonding strength</topic><topic>Brittle fracture</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemical bonds</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Ductile fracture</topic><topic>Ductile-brittle transition</topic><topic>Fracture mechanics</topic><topic>Heat treating</topic><topic>Interface reactions</topic><topic>Intermetallic compounds</topic><topic>Liquid phases</topic><topic>Materials Science</topic><topic>Microstructure</topic><topic>Optical and Electronic Materials</topic><topic>Porosity</topic><topic>Shear properties</topic><topic>Shear strength</topic><topic>Silver</topic><topic>Soldered joints</topic><topic>Solders</topic><topic>Thickness</topic><topic>Tin</topic><topic>Transient liquid phase bonding</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yang, Li</creatorcontrib><creatorcontrib>Xu, Yuhang</creatorcontrib><creatorcontrib>Zhang, Yaocheng</creatorcontrib><creatorcontrib>Lu, Kaijian</creatorcontrib><creatorcontrib>Qiao, Jian</creatorcontrib><creatorcontrib>Yang, Yao</creatorcontrib><creatorcontrib>Xu, Feng</creatorcontrib><creatorcontrib>Gao, Huiming</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>DELNET Engineering & Technology Collection</collection><jtitle>Journal of materials science. Materials in electronics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yang, Li</au><au>Xu, Yuhang</au><au>Zhang, Yaocheng</au><au>Lu, Kaijian</au><au>Qiao, Jian</au><au>Yang, Yao</au><au>Xu, Feng</au><au>Gao, Huiming</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of bonding time on the microstructure and shear property of Cu/SAC-15Ag/Cu 3D package solder joint fabricated by TLP</atitle><jtitle>Journal of materials science. Materials in electronics</jtitle><stitle>J Mater Sci: Mater Electron</stitle><date>2021-04-01</date><risdate>2021</risdate><volume>32</volume><issue>7</issue><spage>8387</spage><epage>8395</epage><pages>8387-8395</pages><issn>0957-4522</issn><eissn>1573-482X</eissn><abstract>In this paper, Cu/SAC-15Ag/Cu 3D package solder joints were prepared by transient liquid phase (TLP) bonding technology. The effects of bonding time on the microstructure and shear property of solder joints were investigated. The results indicated that the microstructure of solder joints is coarsened with increasing bonding time. The intermetallic compounds (IMCs) in the interfacial reaction zone consist of Cu
3
Sn and Cu
6
Sn
5
phase, and the IMCs in the in situ reaction zone include Ag
3
Sn phase, Sn-rich phase, and Ag particles. The thickness of interfacial IMCs layer initially decreases due to the volume contraction caused by the transformation from Cu
6
Sn
5
to Cu
3
Sn, and then increases as a result of the coarsen of Cu
3
Sn. The minimum porosity of the solder joints reaches 0.24% under bonding time of 30 min. The shear strength of solder joints increases first and then declines with the extension of bonding time, and the maximum shear strength of 45.3 MPa is obtained by bonding for 30 min. The shear fracture mechanism of solder joints changes from ductile fracture to ductile–brittle mixed fracture, and then changes to brittle fracture. Cracks nucleate at the voids and propagate quickly with prolonging bonding time, and the cracks could be restrained by the voids.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s10854-021-05434-3</doi><tpages>9</tpages><orcidid>https://orcid.org/0000-0002-4234-785X</orcidid></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0957-4522 |
| ispartof | Journal of materials science. Materials in electronics, 2021-04, Vol.32 (7), p.8387-8395 |
| issn | 0957-4522 1573-482X |
| language | eng |
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| source | SpringerNature Journals |
| subjects | Bonded joints Bonding strength Brittle fracture Characterization and Evaluation of Materials Chemical bonds Chemistry and Materials Science Copper Ductile fracture Ductile-brittle transition Fracture mechanics Heat treating Interface reactions Intermetallic compounds Liquid phases Materials Science Microstructure Optical and Electronic Materials Porosity Shear properties Shear strength Silver Soldered joints Solders Thickness Tin Transient liquid phase bonding |
| title | Effect of bonding time on the microstructure and shear property of Cu/SAC-15Ag/Cu 3D package solder joint fabricated by TLP |
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