Intermetallic compounds formed in Sn droplet on Cu substrate under the impact of electric currents

The present paper investigates the influence of electric currents on the formation of Sn/Cu intermetallic compounds. Solidification experiments of Sn droplets on Cu substrate were performed under the impact of direct csurrents (DC) and pulsed electric currents (ECP), respectively. The results show t...

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Veröffentlicht in:	Journal of materials science 2021-07, Vol.56 (20), p.11953-11969
Hauptverfasser:	Su, Yueying, Zhu, Rui, Zheng, Tianqing, Shen, Yanping, Xu, Yanyi, Chen, Liugang, Zhang, Yunhu, Song, Changjiang, Zheng, Hongxing, Zhai, Qijie
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Classical Mechanics Copper Crystallography and Scattering Methods Droplets Electric currents Interface reactions Intermetallic compounds Lorentz force Magnetic fields Materials Science Metals & Corrosion Numerical analysis Polymer Sciences Solid Mechanics Solidification Substrates Tin
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