Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field

The main scope of this research is to investigate the impact of rotating magnetic field (RMF) on the physical properties of the Sn–0.5Ag–0.5Cu–2.0Sb–0.1Al (SAC0505SbAl) solder alloy. The application of RMF during molten alloy cooling showed prominent effect on the morphology, thermal properties, and...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2021-03, Vol.32 (5), p.6199-6213
Hauptverfasser:	El-Taher, A. M., Abd El Azeem, S. E., Ibrahiem, A. A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Aluminum Antimony Characterization and Evaluation of Materials Chemistry and Materials Science Cooling effects Copper Deformation mechanisms Electronic packaging Energy dissipation Eutectic alloys Lead free Liquid metals Magnetic fields Magnetic properties Materials Science Mechanical properties Modulus of elasticity Morphology Optical and Electronic Materials Physical properties Reliability analysis Rotation Silver Solders Supercooling Thermodynamic properties Tin Tin base alloys
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