Micromechanical Analysis for Iron-Based Composites Under Large Deformations

A micromechanical analysis under large deformations for iron-based composites is introduced to predict the deformation behavior of iron (Fe)-copper (Cu) composites. In particular, pure Fe, pure Cu, Fe-17 wt. % Cu, and Fe-83 wt. % Cu are studied. In Fe-Cu composites, Cu is a soft-phase material. Henc...

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Veröffentlicht in:	Journal of electronic materials 2021-04, Vol.50 (4), p.1752-1758
1. Verfasser:	Dodla, Srihari
Format:	Artikel
Sprache:	eng
Schlagworte:	Asian Consortium ACCMS–International Conference ICMG 2020 Asian Consortium AC–CMS International Conference ICMG 2020 Characterization and Evaluation of Materials Chemistry and Materials Science Composite materials Copper Deformation Electronics and Microelectronics Equilibrium Experiments Heterogeneity Instrumentation Iron constituents Kinematics Materials Science Mechanical properties Numerical models Optical and Electronic Materials Polycrystals Solid State Physics Strain hardening Viscoplastic materials
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