Controllability and mechanism investigation on the subsurface damage of CVD diamond film by Fe-containing vitrified bond wheel

Herein, a Fe-containing vitrified bond wheel was used to polish diamond by chemically mechanical polishing (CMP). Due to tribochemical reaction, the hardness of the polished diamond with adhered layers was 1.94 GPa, the corresponding the material removal rate (MRR) was 78.3 μm h−1. As confirmed by T...

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Veröffentlicht in:	Tribology international 2021-03, Vol.155, p.106774, Article 106774
Hauptverfasser:	Zhang, Mengdi, Xu, Hanqing
Format:	Artikel
Sprache:	eng
Schlagworte:	Chemical-mechanical polishing Chemically mechanical polishing Controllability CVD diamond film Damage Diamond films Diamond polishing Graphitization Iron Material removal rate (machining) Phase transitions Polishes Stability Subsurface damage Tribochemistry
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