Demonstration of p-GaN/AlGaN/GaN High Electron Mobility Transistors With an Indium-Tin-Oxide Gate Electrode

In this study, p-GaN/AlGaN/GaN high electron mobility transistors (HEMTs) with indium-tin-oxide (ITO) gate electrodes are demonstrated. The DC measurements for the devices show a drain current ( \text{I}_{\mathrm{ D}} ) of 438 mA/mm at a \text{V}_{\mathrm{ D}} and a \text{V}_{\mathrm{ G}} of 10...

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Veröffentlicht in:IEEE journal of the Electron Devices Society 2021, Vol.9, p.2-5
Hauptverfasser: Chang, Chih-Yao, Wang, Chien-Sheng, Wang, Ching-Yao, Shen, Yao-Luen, Wu, Tian-Li, Kuo, Wei-Hung, Lin, Suh-Fang, Huang, Chih-Fang
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container_title IEEE journal of the Electron Devices Society
container_volume 9
creator Chang, Chih-Yao
Wang, Chien-Sheng
Wang, Ching-Yao
Shen, Yao-Luen
Wu, Tian-Li
Kuo, Wei-Hung
Lin, Suh-Fang
Huang, Chih-Fang
description In this study, p-GaN/AlGaN/GaN high electron mobility transistors (HEMTs) with indium-tin-oxide (ITO) gate electrodes are demonstrated. The DC measurements for the devices show a drain current ( \text{I}_{\mathrm{ D}} ) of 438 mA/mm at a \text{V}_{\mathrm{ D}} and a \text{V}_{\mathrm{ G}} of 10 and 8 V, respectively. A maximum {g} _{\mathrm{ m}} of 92.1 mS/mm and a specific ON-resistance ( \text{R}_{\mathrm{ on}}\cdot {\mathrm{ A}} ) of 1.86 \text{m}\Omega cm 2 are obtained. Furthermore, the robustness of the ITO gate electrode atop the p-GaN layer under the forward gate bias is studied, indicating stable \text{I}_{\mathrm{ G}}-{\mathrm{ V}}_{\mathrm{ G}} and \text{I}_{\mathrm{ D}}-{\mathrm{ V}}_{\mathrm{ G}} characteristics for a gate voltage of less than 11 V, which is higher than the compared device with Ni/Au Schottky gate contact. Therefore, ITO gate electrodes, which are compatible with the Light-emitting diode (LED) process, are a promising alternative for p-GaN HEMT technologies.
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The DC measurements for the devices show a drain current (<inline-formula> <tex-math notation="LaTeX">\text{I}_{\mathrm{ D}} </tex-math></inline-formula>) of 438 mA/mm at a <inline-formula> <tex-math notation="LaTeX">\text{V}_{\mathrm{ D}} </tex-math></inline-formula> and a <inline-formula> <tex-math notation="LaTeX">\text{V}_{\mathrm{ G}} </tex-math></inline-formula> of 10 and 8 V, respectively. A maximum <inline-formula> <tex-math notation="LaTeX">{g} _{\mathrm{ m}} </tex-math></inline-formula> of 92.1 mS/mm and a specific ON-resistance (<inline-formula> <tex-math notation="LaTeX">\text{R}_{\mathrm{ on}}\cdot {\mathrm{ A}} </tex-math></inline-formula>) of 1.86 <inline-formula> <tex-math notation="LaTeX">\text{m}\Omega </tex-math></inline-formula>cm 2 are obtained. Furthermore, the robustness of the ITO gate electrode atop the p-GaN layer under the forward gate bias is studied, indicating stable <inline-formula> <tex-math notation="LaTeX">\text{I}_{\mathrm{ G}}-{\mathrm{ V}}_{\mathrm{ G}} </tex-math></inline-formula> and <inline-formula> <tex-math notation="LaTeX">\text{I}_{\mathrm{ D}}-{\mathrm{ V}}_{\mathrm{ G}} </tex-math></inline-formula> characteristics for a gate voltage of less than 11 V, which is higher than the compared device with Ni/Au Schottky gate contact. Therefore, ITO gate electrodes, which are compatible with the Light-emitting diode (LED) process, are a promising alternative for p-GaN HEMT technologies.]]></description><identifier>ISSN: 2168-6734</identifier><identifier>EISSN: 2168-6734</identifier><identifier>DOI: 10.1109/JEDS.2020.3030911</identifier><identifier>CODEN: IJEDAC</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Aluminum gallium nitride ; Aluminum gallium nitrides ; Electrodes ; Gallium nitrides ; GaN ; HEMTs ; high electron mobility transistor (HEMT) ; High electron mobility transistors ; Indium tin oxide ; Indium tin oxides ; indium–tin–oxide gate electrode ; Light emitting diodes ; Logic gates ; MODFETs ; Semiconductor devices ; Transistors</subject><ispartof>IEEE journal of the Electron Devices Society, 2021, Vol.9, p.2-5</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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The DC measurements for the devices show a drain current (<inline-formula> <tex-math notation="LaTeX">\text{I}_{\mathrm{ D}} </tex-math></inline-formula>) of 438 mA/mm at a <inline-formula> <tex-math notation="LaTeX">\text{V}_{\mathrm{ D}} </tex-math></inline-formula> and a <inline-formula> <tex-math notation="LaTeX">\text{V}_{\mathrm{ G}} </tex-math></inline-formula> of 10 and 8 V, respectively. A maximum <inline-formula> <tex-math notation="LaTeX">{g} _{\mathrm{ m}} </tex-math></inline-formula> of 92.1 mS/mm and a specific ON-resistance (<inline-formula> <tex-math notation="LaTeX">\text{R}_{\mathrm{ on}}\cdot {\mathrm{ A}} </tex-math></inline-formula>) of 1.86 <inline-formula> <tex-math notation="LaTeX">\text{m}\Omega </tex-math></inline-formula>cm 2 are obtained. Furthermore, the robustness of the ITO gate electrode atop the p-GaN layer under the forward gate bias is studied, indicating stable <inline-formula> <tex-math notation="LaTeX">\text{I}_{\mathrm{ G}}-{\mathrm{ V}}_{\mathrm{ G}} </tex-math></inline-formula> and <inline-formula> <tex-math notation="LaTeX">\text{I}_{\mathrm{ D}}-{\mathrm{ V}}_{\mathrm{ G}} </tex-math></inline-formula> characteristics for a gate voltage of less than 11 V, which is higher than the compared device with Ni/Au Schottky gate contact. Therefore, ITO gate electrodes, which are compatible with the Light-emitting diode (LED) process, are a promising alternative for p-GaN HEMT technologies.]]></description><subject>Aluminum gallium nitride</subject><subject>Aluminum gallium nitrides</subject><subject>Electrodes</subject><subject>Gallium nitrides</subject><subject>GaN</subject><subject>HEMTs</subject><subject>high electron mobility transistor (HEMT)</subject><subject>High electron mobility transistors</subject><subject>Indium tin oxide</subject><subject>Indium tin oxides</subject><subject>indium–tin–oxide gate electrode</subject><subject>Light emitting diodes</subject><subject>Logic gates</subject><subject>MODFETs</subject><subject>Semiconductor devices</subject><subject>Transistors</subject><issn>2168-6734</issn><issn>2168-6734</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>RIE</sourceid><sourceid>DOA</sourceid><recordid>eNpNUU1rGzEQXUoDDWl-QOlF0PM6-rJWOobEdRzS5FCXHsWsNJvIXa9cSYbm31eO09CB-WB4783Aa5pPjM4Yo-bidnH9fcYppzNBBTWMvWtOOVO6VZ2Q7_-bPzTnOW9oDc2UUeq0-XWN2zjlkqCEOJE4kF27hPuLy_FQa5Kb8PhEFiO6kirgW-zDGMozWSeYcsglpkx-hvJEYCKryYf9tl2HqX34EzySJRT8x_X4sTkZYMx4_trPmh9fF-urm_buYbm6urxrnaS8tHzgWkgDdJCKCtS0B-g9R6ncIJTxNcGLbi7BQD84ZSQdtAFm0HPtqBNnzeqo6yNs7C6FLaRnGyHYl0VMjxZSCW5Ei1r3HrHzhoPkRuleeOlQONSKdbKvWl-OWrsUf-8xF7uJ-zTV9y2XRsxNvT6vKHZEuRRzTji8XWXUHiyyB4vswSL7alHlfD5yAiK-4Q3nomNa_AV8J4v4</recordid><startdate>2021</startdate><enddate>2021</enddate><creator>Chang, Chih-Yao</creator><creator>Wang, Chien-Sheng</creator><creator>Wang, Ching-Yao</creator><creator>Shen, Yao-Luen</creator><creator>Wu, Tian-Li</creator><creator>Kuo, Wei-Hung</creator><creator>Lin, Suh-Fang</creator><creator>Huang, Chih-Fang</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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The DC measurements for the devices show a drain current (<inline-formula> <tex-math notation="LaTeX">\text{I}_{\mathrm{ D}} </tex-math></inline-formula>) of 438 mA/mm at a <inline-formula> <tex-math notation="LaTeX">\text{V}_{\mathrm{ D}} </tex-math></inline-formula> and a <inline-formula> <tex-math notation="LaTeX">\text{V}_{\mathrm{ G}} </tex-math></inline-formula> of 10 and 8 V, respectively. A maximum <inline-formula> <tex-math notation="LaTeX">{g} _{\mathrm{ m}} </tex-math></inline-formula> of 92.1 mS/mm and a specific ON-resistance (<inline-formula> <tex-math notation="LaTeX">\text{R}_{\mathrm{ on}}\cdot {\mathrm{ A}} </tex-math></inline-formula>) of 1.86 <inline-formula> <tex-math notation="LaTeX">\text{m}\Omega </tex-math></inline-formula>cm 2 are obtained. Furthermore, the robustness of the ITO gate electrode atop the p-GaN layer under the forward gate bias is studied, indicating stable <inline-formula> <tex-math notation="LaTeX">\text{I}_{\mathrm{ G}}-{\mathrm{ V}}_{\mathrm{ G}} </tex-math></inline-formula> and <inline-formula> <tex-math notation="LaTeX">\text{I}_{\mathrm{ D}}-{\mathrm{ V}}_{\mathrm{ G}} </tex-math></inline-formula> characteristics for a gate voltage of less than 11 V, which is higher than the compared device with Ni/Au Schottky gate contact. Therefore, ITO gate electrodes, which are compatible with the Light-emitting diode (LED) process, are a promising alternative for p-GaN HEMT technologies.]]></abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JEDS.2020.3030911</doi><tpages>4</tpages><orcidid>https://orcid.org/0000-0002-1421-9789</orcidid><orcidid>https://orcid.org/0000-0001-6788-5470</orcidid><orcidid>https://orcid.org/0000-0003-3534-085X</orcidid><oa>free_for_read</oa></addata></record>
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subjects Aluminum gallium nitride
Aluminum gallium nitrides
Electrodes
Gallium nitrides
GaN
HEMTs
high electron mobility transistor (HEMT)
High electron mobility transistors
Indium tin oxide
Indium tin oxides
indium–tin–oxide gate electrode
Light emitting diodes
Logic gates
MODFETs
Semiconductor devices
Transistors
title Demonstration of p-GaN/AlGaN/GaN High Electron Mobility Transistors With an Indium-Tin-Oxide Gate Electrode
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