Application of Microscopic Methods to the Study on the Surface Layers of Aluminum Alloys after Tribotechnical Testing
By using a combination of electron and probe microscopy, the effect of the additives of low-melting alloying elements introduced into antifriction Al–5% Si–4% Cu–4% Sn aluminum alloys exerted on the surface change after tribotechnical testing has been studied. Electron microscopic (SEM) studies have...
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Veröffentlicht in: | Inorganic materials : applied research 2021, Vol.12 (1), p.133-141 |
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creator | Shcherbakova, O. O. Muravyeva, T. I. Zagorskiy, D. L. Shkalei, I. V. |
description | By using a combination of electron and probe microscopy, the effect of the additives of low-melting alloying elements introduced into antifriction Al–5% Si–4% Cu–4% Sn aluminum alloys exerted on the surface change after tribotechnical testing has been studied. Electron microscopic (SEM) studies have shown that, in the course of friction, the deformation of grains, the release of a soft phase to the surface, and mass transfer occur. It has been found by means of scanning probe microscopy (SPM) that the thermal conductivity map at the microlevel correlates with the electrical conductivity map, which makes it possible to measure the electrical conductivity in order to assess the thermal properties. |
doi_str_mv | 10.1134/S207511332101038X |
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It has been found by means of scanning probe microscopy (SPM) that the thermal conductivity map at the microlevel correlates with the electrical conductivity map, which makes it possible to measure the electrical conductivity in order to assess the thermal properties.</description><subject>Additives</subject><subject>Alloying effects</subject><subject>Alloying elements</subject><subject>Aluminum</subject><subject>Aluminum alloys</subject><subject>Chemistry</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Electrical resistivity</subject><subject>Industrial Chemistry/Chemical Engineering</subject><subject>Inorganic Chemistry</subject><subject>Mass transfer</subject><subject>Materials Science</subject><subject>Microscopy</subject><subject>Scanning probe microscopy</subject><subject>Silicon</subject><subject>Surface layers</subject><subject>Thermal conductivity</subject><subject>Thermodynamic properties</subject><issn>2075-1133</issn><issn>2075-115X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><recordid>eNp1UE1PwzAMjRBITGM_gFskzgU7afpxnCa-pE0cNqTdqixLt0xdU5L0sH9PyhAcEL742XrPzzYhtwj3iDx9WDLIRUScISDwYn1BRkMrQRTryx_M-TWZeH-AGAJFmYoR6add1xglg7EttTVdGOWsV7Yzii502Nutp8HSsNd0GfrtiUbaV9G7WipN5_KknR-U06Y_mrY_RtDYk6eyDtrRlTMbG7Tat9GkoSvtg2l3N-Sqlo3Xk-88Ju9Pj6vZSzJ_e36dTeeJ4iBCUkAGUG40FkpLhLgxk4zxDLO8kCITILep4FmJkuWbggsBWVpzzKFmspAS-Zjcned2zn700bs62N610bJiaclYmZdQRhaeWcPp3um66pw5SneqEKrhwdWfB0cNO2t85LY77X4n_y_6BNore-g</recordid><startdate>2021</startdate><enddate>2021</enddate><creator>Shcherbakova, O. 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Res</stitle><date>2021</date><risdate>2021</risdate><volume>12</volume><issue>1</issue><spage>133</spage><epage>141</epage><pages>133-141</pages><issn>2075-1133</issn><eissn>2075-115X</eissn><abstract>By using a combination of electron and probe microscopy, the effect of the additives of low-melting alloying elements introduced into antifriction Al–5% Si–4% Cu–4% Sn aluminum alloys exerted on the surface change after tribotechnical testing has been studied. Electron microscopic (SEM) studies have shown that, in the course of friction, the deformation of grains, the release of a soft phase to the surface, and mass transfer occur. 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subjects | Additives Alloying effects Alloying elements Aluminum Aluminum alloys Chemistry Chemistry and Materials Science Copper Electrical resistivity Industrial Chemistry/Chemical Engineering Inorganic Chemistry Mass transfer Materials Science Microscopy Scanning probe microscopy Silicon Surface layers Thermal conductivity Thermodynamic properties |
title | Application of Microscopic Methods to the Study on the Surface Layers of Aluminum Alloys after Tribotechnical Testing |
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