The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly
This paper presents the influence of Fe 2 O 3 nanoparticles on the microstructure and fillet height for the ultra-fine electronics assembly in the reflow soldering process. Lead-free SAC solder paste was reinforced with different weighted percentages of Fe 2 O 3 nanoparticles (i.e., 0.01, 0.05, and...
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| Veröffentlicht in: | International journal of advanced manufacturing technology 2018-04, Vol.96 (1-4), p.717-733 |
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| creator | Che Ani, F. Jalar, A. Saad, A. A. Khor, C. Y. Ismail, R. Bachok, Z. Abas, M. A. Othman, N. K. |
| description | This paper presents the influence of Fe
2
O
3
nanoparticles on the microstructure and fillet height for the ultra-fine electronics assembly in the reflow soldering process. Lead-free SAC solder paste was reinforced with different weighted percentages of Fe
2
O
3
nanoparticles (i.e., 0.01, 0.05, and 0.15 wt.%) using a mechanical solder paste mixer. A new form of nano-reinforced lead-free solder paste was applied to assemble the ultra-fine capacitor (i.e., 01005 size) onto the printed circuit board by applying the reflow soldering method. Focused ion beam (FIB), high-resolution transmission electron microscope (HRTEM) system equipped with energy-dispersive X-ray spectroscopy (EDS), field emission scanning electron microscopy coupled with energy-dispersive X-ray spectroscopy (EDS), and nanoindentation tester, were all used to examine the microstructure, hardness, and the fillet height of the solder joints. The experimental results revealed that nano-reinforced solder with the content of 0.01, 0.05, and 0.05 wt% yielded small changes in the intermetallic layers. Furthermore, applying an increment of Fe
2
O
3
to 0.05 wt% also improved the fillet height. The mechanism of the agglomeration of Fe
2
O
3
in the bulk solder is discussed in this study. Moreover, simulation analysis using the volume of fluid (VOF) and discrete phase method (DPM) was both employed to describe the mechanism of nanoparticle distribution in the solder and the reflow soldering process. The findings are expected to provide profound knowledge and further reference towards the reflow soldering process of the miniaturised electronic package. |
| doi_str_mv | 10.1007/s00170-018-1583-z |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2490846126</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2019846765</sourcerecordid><originalsourceid>FETCH-LOGICAL-c372t-8b36310fb94180f55e261e9c3da9cdb90fc25c009a90b297fa8db62f4834f5433</originalsourceid><addsrcrecordid>eNp9kbFOwzAQhi0EEqXwAGyWmA1nO3HssaooIFXqQJktxzlDqzQpdjq0T4-rIjHRycN933_y_YTcc3jkANVTAuAVMOCa8VJLdrggI15IySTw8pKMQCjNZKX0NblJaZ1pxZUekXr5hXTVhXaHnUfaBzpDsZC0c13PIuZJHz029H0ypS26hoWISFPfNhizR4es79ohOhZWHVJs0Q-x71Y-UZcSbup2f0uugmsT3v2-Y_Ixe15OX9l88fI2ncyZl5UYmK6lkhxCbQquIZQlCsXReNk445vaQPCi9ADGGaiFqYLTTa1EKLQsQpm_OiYPp9xt7L93mAa77nexyyutKAzoQnGhzlJCiXy8QuqzFHCTsypVZoqfKB_7lCIGu42rjYt7y8Eea7GnWmyuxR5rsYfsiJOTMtt9YvxL_l_6ASWajbw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2262158438</pqid></control><display><type>article</type><title>The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly</title><source>SpringerLink Journals - AutoHoldings</source><creator>Che Ani, F. ; Jalar, A. ; Saad, A. A. ; Khor, C. Y. ; Ismail, R. ; Bachok, Z. ; Abas, M. A. ; Othman, N. K.</creator><creatorcontrib>Che Ani, F. ; Jalar, A. ; Saad, A. A. ; Khor, C. Y. ; Ismail, R. ; Bachok, Z. ; Abas, M. A. ; Othman, N. K.</creatorcontrib><description>This paper presents the influence of Fe
2
O
3
nanoparticles on the microstructure and fillet height for the ultra-fine electronics assembly in the reflow soldering process. Lead-free SAC solder paste was reinforced with different weighted percentages of Fe
2
O
3
nanoparticles (i.e., 0.01, 0.05, and 0.15 wt.%) using a mechanical solder paste mixer. A new form of nano-reinforced lead-free solder paste was applied to assemble the ultra-fine capacitor (i.e., 01005 size) onto the printed circuit board by applying the reflow soldering method. Focused ion beam (FIB), high-resolution transmission electron microscope (HRTEM) system equipped with energy-dispersive X-ray spectroscopy (EDS), field emission scanning electron microscopy coupled with energy-dispersive X-ray spectroscopy (EDS), and nanoindentation tester, were all used to examine the microstructure, hardness, and the fillet height of the solder joints. The experimental results revealed that nano-reinforced solder with the content of 0.01, 0.05, and 0.05 wt% yielded small changes in the intermetallic layers. Furthermore, applying an increment of Fe
2
O
3
to 0.05 wt% also improved the fillet height. The mechanism of the agglomeration of Fe
2
O
3
in the bulk solder is discussed in this study. Moreover, simulation analysis using the volume of fluid (VOF) and discrete phase method (DPM) was both employed to describe the mechanism of nanoparticle distribution in the solder and the reflow soldering process. The findings are expected to provide profound knowledge and further reference towards the reflow soldering process of the miniaturised electronic package.</description><identifier>ISSN: 0268-3768</identifier><identifier>EISSN: 1433-3015</identifier><identifier>DOI: 10.1007/s00170-018-1583-z</identifier><language>eng</language><publisher>London: Springer London</publisher><subject>Assembly ; CAE) and Design ; Circuits ; Computer-Aided Engineering (CAD ; Dispersion ; Electron microscopes ; Electron microscopy ; Electronics ; Energy dispersive X ray spectroscopy ; Energy transmission ; Engineering ; Field emission microscopy ; Field emission spectroscopy ; Fillets ; Industrial and Production Engineering ; Ion beams ; Iron oxides ; Lead free ; Manufacturing ; Mechanical Engineering ; Media Management ; Microstructure ; Nanoindentation ; Nanoparticles ; Original Article ; Reflow soldering ; Scanning electron microscopy ; Solders ; Spectrum analysis</subject><ispartof>International journal of advanced manufacturing technology, 2018-04, Vol.96 (1-4), p.717-733</ispartof><rights>Springer-Verlag London Ltd., part of Springer Nature 2018</rights><rights>Copyright Springer Science & Business Media 2018</rights><rights>The International Journal of Advanced Manufacturing Technology is a copyright of Springer, (2018). All Rights Reserved.</rights><rights>Springer-Verlag London Ltd., part of Springer Nature 2018.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c372t-8b36310fb94180f55e261e9c3da9cdb90fc25c009a90b297fa8db62f4834f5433</citedby><cites>FETCH-LOGICAL-c372t-8b36310fb94180f55e261e9c3da9cdb90fc25c009a90b297fa8db62f4834f5433</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s00170-018-1583-z$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s00170-018-1583-z$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Che Ani, F.</creatorcontrib><creatorcontrib>Jalar, A.</creatorcontrib><creatorcontrib>Saad, A. A.</creatorcontrib><creatorcontrib>Khor, C. Y.</creatorcontrib><creatorcontrib>Ismail, R.</creatorcontrib><creatorcontrib>Bachok, Z.</creatorcontrib><creatorcontrib>Abas, M. A.</creatorcontrib><creatorcontrib>Othman, N. K.</creatorcontrib><title>The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly</title><title>International journal of advanced manufacturing technology</title><addtitle>Int J Adv Manuf Technol</addtitle><description>This paper presents the influence of Fe
2
O
3
nanoparticles on the microstructure and fillet height for the ultra-fine electronics assembly in the reflow soldering process. Lead-free SAC solder paste was reinforced with different weighted percentages of Fe
2
O
3
nanoparticles (i.e., 0.01, 0.05, and 0.15 wt.%) using a mechanical solder paste mixer. A new form of nano-reinforced lead-free solder paste was applied to assemble the ultra-fine capacitor (i.e., 01005 size) onto the printed circuit board by applying the reflow soldering method. Focused ion beam (FIB), high-resolution transmission electron microscope (HRTEM) system equipped with energy-dispersive X-ray spectroscopy (EDS), field emission scanning electron microscopy coupled with energy-dispersive X-ray spectroscopy (EDS), and nanoindentation tester, were all used to examine the microstructure, hardness, and the fillet height of the solder joints. The experimental results revealed that nano-reinforced solder with the content of 0.01, 0.05, and 0.05 wt% yielded small changes in the intermetallic layers. Furthermore, applying an increment of Fe
2
O
3
to 0.05 wt% also improved the fillet height. The mechanism of the agglomeration of Fe
2
O
3
in the bulk solder is discussed in this study. Moreover, simulation analysis using the volume of fluid (VOF) and discrete phase method (DPM) was both employed to describe the mechanism of nanoparticle distribution in the solder and the reflow soldering process. The findings are expected to provide profound knowledge and further reference towards the reflow soldering process of the miniaturised electronic package.</description><subject>Assembly</subject><subject>CAE) and Design</subject><subject>Circuits</subject><subject>Computer-Aided Engineering (CAD</subject><subject>Dispersion</subject><subject>Electron microscopes</subject><subject>Electron microscopy</subject><subject>Electronics</subject><subject>Energy dispersive X ray spectroscopy</subject><subject>Energy transmission</subject><subject>Engineering</subject><subject>Field emission microscopy</subject><subject>Field emission spectroscopy</subject><subject>Fillets</subject><subject>Industrial and Production Engineering</subject><subject>Ion beams</subject><subject>Iron oxides</subject><subject>Lead free</subject><subject>Manufacturing</subject><subject>Mechanical Engineering</subject><subject>Media Management</subject><subject>Microstructure</subject><subject>Nanoindentation</subject><subject>Nanoparticles</subject><subject>Original Article</subject><subject>Reflow soldering</subject><subject>Scanning electron microscopy</subject><subject>Solders</subject><subject>Spectrum analysis</subject><issn>0268-3768</issn><issn>1433-3015</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp9kbFOwzAQhi0EEqXwAGyWmA1nO3HssaooIFXqQJktxzlDqzQpdjq0T4-rIjHRycN933_y_YTcc3jkANVTAuAVMOCa8VJLdrggI15IySTw8pKMQCjNZKX0NblJaZ1pxZUekXr5hXTVhXaHnUfaBzpDsZC0c13PIuZJHz029H0ypS26hoWISFPfNhizR4es79ohOhZWHVJs0Q-x71Y-UZcSbup2f0uugmsT3v2-Y_Ixe15OX9l88fI2ncyZl5UYmK6lkhxCbQquIZQlCsXReNk445vaQPCi9ADGGaiFqYLTTa1EKLQsQpm_OiYPp9xt7L93mAa77nexyyutKAzoQnGhzlJCiXy8QuqzFHCTsypVZoqfKB_7lCIGu42rjYt7y8Eea7GnWmyuxR5rsYfsiJOTMtt9YvxL_l_6ASWajbw</recordid><startdate>20180401</startdate><enddate>20180401</enddate><creator>Che Ani, F.</creator><creator>Jalar, A.</creator><creator>Saad, A. 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K.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c372t-8b36310fb94180f55e261e9c3da9cdb90fc25c009a90b297fa8db62f4834f5433</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Assembly</topic><topic>CAE) and Design</topic><topic>Circuits</topic><topic>Computer-Aided Engineering (CAD</topic><topic>Dispersion</topic><topic>Electron microscopes</topic><topic>Electron microscopy</topic><topic>Electronics</topic><topic>Energy dispersive X ray spectroscopy</topic><topic>Energy transmission</topic><topic>Engineering</topic><topic>Field emission microscopy</topic><topic>Field emission spectroscopy</topic><topic>Fillets</topic><topic>Industrial and Production Engineering</topic><topic>Ion beams</topic><topic>Iron oxides</topic><topic>Lead free</topic><topic>Manufacturing</topic><topic>Mechanical Engineering</topic><topic>Media Management</topic><topic>Microstructure</topic><topic>Nanoindentation</topic><topic>Nanoparticles</topic><topic>Original Article</topic><topic>Reflow soldering</topic><topic>Scanning electron microscopy</topic><topic>Solders</topic><topic>Spectrum analysis</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Che Ani, F.</creatorcontrib><creatorcontrib>Jalar, A.</creatorcontrib><creatorcontrib>Saad, A. A.</creatorcontrib><creatorcontrib>Khor, C. Y.</creatorcontrib><creatorcontrib>Ismail, R.</creatorcontrib><creatorcontrib>Bachok, Z.</creatorcontrib><creatorcontrib>Abas, M. A.</creatorcontrib><creatorcontrib>Othman, N. K.</creatorcontrib><collection>CrossRef</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><jtitle>International journal of advanced manufacturing technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Che Ani, F.</au><au>Jalar, A.</au><au>Saad, A. A.</au><au>Khor, C. Y.</au><au>Ismail, R.</au><au>Bachok, Z.</au><au>Abas, M. A.</au><au>Othman, N. K.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly</atitle><jtitle>International journal of advanced manufacturing technology</jtitle><stitle>Int J Adv Manuf Technol</stitle><date>2018-04-01</date><risdate>2018</risdate><volume>96</volume><issue>1-4</issue><spage>717</spage><epage>733</epage><pages>717-733</pages><issn>0268-3768</issn><eissn>1433-3015</eissn><abstract>This paper presents the influence of Fe
2
O
3
nanoparticles on the microstructure and fillet height for the ultra-fine electronics assembly in the reflow soldering process. Lead-free SAC solder paste was reinforced with different weighted percentages of Fe
2
O
3
nanoparticles (i.e., 0.01, 0.05, and 0.15 wt.%) using a mechanical solder paste mixer. A new form of nano-reinforced lead-free solder paste was applied to assemble the ultra-fine capacitor (i.e., 01005 size) onto the printed circuit board by applying the reflow soldering method. Focused ion beam (FIB), high-resolution transmission electron microscope (HRTEM) system equipped with energy-dispersive X-ray spectroscopy (EDS), field emission scanning electron microscopy coupled with energy-dispersive X-ray spectroscopy (EDS), and nanoindentation tester, were all used to examine the microstructure, hardness, and the fillet height of the solder joints. The experimental results revealed that nano-reinforced solder with the content of 0.01, 0.05, and 0.05 wt% yielded small changes in the intermetallic layers. Furthermore, applying an increment of Fe
2
O
3
to 0.05 wt% also improved the fillet height. The mechanism of the agglomeration of Fe
2
O
3
in the bulk solder is discussed in this study. Moreover, simulation analysis using the volume of fluid (VOF) and discrete phase method (DPM) was both employed to describe the mechanism of nanoparticle distribution in the solder and the reflow soldering process. The findings are expected to provide profound knowledge and further reference towards the reflow soldering process of the miniaturised electronic package.</abstract><cop>London</cop><pub>Springer London</pub><doi>10.1007/s00170-018-1583-z</doi><tpages>17</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0268-3768 |
| ispartof | International journal of advanced manufacturing technology, 2018-04, Vol.96 (1-4), p.717-733 |
| issn | 0268-3768 1433-3015 |
| language | eng |
| recordid | cdi_proquest_journals_2490846126 |
| source | SpringerLink Journals - AutoHoldings |
| subjects | Assembly CAE) and Design Circuits Computer-Aided Engineering (CAD Dispersion Electron microscopes Electron microscopy Electronics Energy dispersive X ray spectroscopy Energy transmission Engineering Field emission microscopy Field emission spectroscopy Fillets Industrial and Production Engineering Ion beams Iron oxides Lead free Manufacturing Mechanical Engineering Media Management Microstructure Nanoindentation Nanoparticles Original Article Reflow soldering Scanning electron microscopy Solders Spectrum analysis |
| title | The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly |
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