Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints
This paper investigates the effect of soldering temperature on solder joint voids and reliability of flip-chip LED chips during reflow soldering. Lead-free solder SAC305 was used as solder paste. The void ratio of the flip-chip LED solder joint at 250°C, 260°C, 270°C, 280°C, and 290°C reflow solderi...
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| Veröffentlicht in: | Journal of electronic materials 2021-03, Vol.50 (3), p.869-880 |
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| creator | Xinmeng, Zhai Yuefeng, Li Jun, Zou Mingming, Shi Bobo, Yang Yang, Li Chunfeng, Guo Rongrong, Hu |
| description | This paper investigates the effect of soldering temperature on solder joint voids and reliability of flip-chip LED chips during reflow soldering. Lead-free solder SAC305 was used as solder paste. The void ratio of the flip-chip LED solder joint at 250°C, 260°C, 270°C, 280°C, and 290°C reflow soldering temperatures was detected by x-ray detector. Shear tests were conducted to evaluate the influence of interfacial reactions on the mechanical reliability of solder joints. The distribution of voids in the shear section was observed by scanning electron microscope (SEM). Next, the photoelectric and thermal properties of FC-LED filament were tested and analyzed. Finally, a high-temperature and high-humidity aging experiment was carried out to test the reliability of the LED filament. The results show that the void ratio of the LED filament soldering joint is the lowest when the soldering temperature is 270°C. The small void ratio of the solder joints results in lower steady-state voltage and junction temperature of the flip-chip LED filament. As the void density in the solder joint decreases, the shear strength of the solder joint increases. At this time, the shear resistance and mechanical reliability are the highest. |
| doi_str_mv | 10.1007/s11664-020-08715-5 |
| format | Article |
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Lead-free solder SAC305 was used as solder paste. The void ratio of the flip-chip LED solder joint at 250°C, 260°C, 270°C, 280°C, and 290°C reflow soldering temperatures was detected by x-ray detector. Shear tests were conducted to evaluate the influence of interfacial reactions on the mechanical reliability of solder joints. The distribution of voids in the shear section was observed by scanning electron microscope (SEM). Next, the photoelectric and thermal properties of FC-LED filament were tested and analyzed. Finally, a high-temperature and high-humidity aging experiment was carried out to test the reliability of the LED filament. The results show that the void ratio of the LED filament soldering joint is the lowest when the soldering temperature is 270°C. The small void ratio of the solder joints results in lower steady-state voltage and junction temperature of the flip-chip LED filament. As the void density in the solder joint decreases, the shear strength of the solder joint increases. At this time, the shear resistance and mechanical reliability are the highest.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-020-08715-5</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Copper ; Electronics and Microelectronics ; Emerging Interconnection Technology ; Flip chip soldering ; High temperature ; Instrumentation ; Interconnect ; Interface reactions ; Lead free ; Materials Science ; Optical and Electronic Materials ; Pb-free Solder ; Photoelectricity ; Reflow soldering ; Reliability analysis ; Shear strength ; Shear tests ; Silver ; Soldered joints ; Solders ; Solid State Physics ; Thermodynamic properties ; Tin ; Tin base alloys ; TMS2020 Advanced Microelectronic Packaging ; TMS2020 Microelectronic Packaging ; Void ratio ; X ray detectors</subject><ispartof>Journal of electronic materials, 2021-03, Vol.50 (3), p.869-880</ispartof><rights>The Minerals, Metals & Materials Society 2021</rights><rights>The Minerals, Metals & Materials Society 2021.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c319t-1d4f645141eb2c69b6b7809173a986ed0a48cce34586fb9662177c1f518b44c43</citedby><cites>FETCH-LOGICAL-c319t-1d4f645141eb2c69b6b7809173a986ed0a48cce34586fb9662177c1f518b44c43</cites><orcidid>0000-0002-9548-5957</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-020-08715-5$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-020-08715-5$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Xinmeng, Zhai</creatorcontrib><creatorcontrib>Yuefeng, Li</creatorcontrib><creatorcontrib>Jun, Zou</creatorcontrib><creatorcontrib>Mingming, Shi</creatorcontrib><creatorcontrib>Bobo, Yang</creatorcontrib><creatorcontrib>Yang, Li</creatorcontrib><creatorcontrib>Chunfeng, Guo</creatorcontrib><creatorcontrib>Rongrong, Hu</creatorcontrib><title>Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>This paper investigates the effect of soldering temperature on solder joint voids and reliability of flip-chip LED chips during reflow soldering. Lead-free solder SAC305 was used as solder paste. The void ratio of the flip-chip LED solder joint at 250°C, 260°C, 270°C, 280°C, and 290°C reflow soldering temperatures was detected by x-ray detector. Shear tests were conducted to evaluate the influence of interfacial reactions on the mechanical reliability of solder joints. The distribution of voids in the shear section was observed by scanning electron microscope (SEM). Next, the photoelectric and thermal properties of FC-LED filament were tested and analyzed. Finally, a high-temperature and high-humidity aging experiment was carried out to test the reliability of the LED filament. The results show that the void ratio of the LED filament soldering joint is the lowest when the soldering temperature is 270°C. The small void ratio of the solder joints results in lower steady-state voltage and junction temperature of the flip-chip LED filament. As the void density in the solder joint decreases, the shear strength of the solder joint increases. At this time, the shear resistance and mechanical reliability are the highest.</description><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Electronics and Microelectronics</subject><subject>Emerging Interconnection Technology</subject><subject>Flip chip soldering</subject><subject>High temperature</subject><subject>Instrumentation</subject><subject>Interconnect</subject><subject>Interface reactions</subject><subject>Lead free</subject><subject>Materials Science</subject><subject>Optical and Electronic Materials</subject><subject>Pb-free Solder</subject><subject>Photoelectricity</subject><subject>Reflow soldering</subject><subject>Reliability analysis</subject><subject>Shear strength</subject><subject>Shear tests</subject><subject>Silver</subject><subject>Soldered joints</subject><subject>Solders</subject><subject>Solid State Physics</subject><subject>Thermodynamic properties</subject><subject>Tin</subject><subject>Tin base alloys</subject><subject>TMS2020 Advanced Microelectronic Packaging</subject><subject>TMS2020 Microelectronic Packaging</subject><subject>Void ratio</subject><subject>X ray detectors</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>BENPR</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp9kEtLw0AUhQdRsFb_gKsB16NzM48ky1JaHxQEreJuSCZ3akqaxJlk0X9v2hTcubqb851z-Qi5BX4PnMcPAUBryXjEGU9iUEydkQkoKRgk-uucTLjQwFQk1CW5CmHLOShIYEI-F86h7Wjj6HtTFejLekPXuGvRZ13vkTY17b6RvmFVZnlZld3-mK3ZbMPmPV1hVrClRzzh9KUp6y5ckwuXVQFvTndKPpaL9fyJrV4fn-ezFbMC0o5BIZ2WCiRgHlmd5jqPE55CLLI00VjwTCbWopAq0S5PtY4gji244fdcSivFlNyNva1vfnoMndk2va-HSRPJlEsexZAOqWhMWd-E4NGZ1pe7zO8NcHPwZ0Z_ZvBnjv6MGiAxQqE9SEH_V_0P9Qs3MnEE</recordid><startdate>20210301</startdate><enddate>20210301</enddate><creator>Xinmeng, Zhai</creator><creator>Yuefeng, Li</creator><creator>Jun, Zou</creator><creator>Mingming, Shi</creator><creator>Bobo, Yang</creator><creator>Yang, Li</creator><creator>Chunfeng, Guo</creator><creator>Rongrong, Hu</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope><orcidid>https://orcid.org/0000-0002-9548-5957</orcidid></search><sort><creationdate>20210301</creationdate><title>Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints</title><author>Xinmeng, Zhai ; Yuefeng, Li ; Jun, Zou ; Mingming, Shi ; Bobo, Yang ; Yang, Li ; Chunfeng, Guo ; Rongrong, Hu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c319t-1d4f645141eb2c69b6b7809173a986ed0a48cce34586fb9662177c1f518b44c43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Electronics and Microelectronics</topic><topic>Emerging Interconnection Technology</topic><topic>Flip chip soldering</topic><topic>High temperature</topic><topic>Instrumentation</topic><topic>Interconnect</topic><topic>Interface reactions</topic><topic>Lead free</topic><topic>Materials Science</topic><topic>Optical and Electronic Materials</topic><topic>Pb-free Solder</topic><topic>Photoelectricity</topic><topic>Reflow soldering</topic><topic>Reliability analysis</topic><topic>Shear strength</topic><topic>Shear tests</topic><topic>Silver</topic><topic>Soldered joints</topic><topic>Solders</topic><topic>Solid State Physics</topic><topic>Thermodynamic properties</topic><topic>Tin</topic><topic>Tin base alloys</topic><topic>TMS2020 Advanced Microelectronic Packaging</topic><topic>TMS2020 Microelectronic Packaging</topic><topic>Void ratio</topic><topic>X ray detectors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Xinmeng, Zhai</creatorcontrib><creatorcontrib>Yuefeng, Li</creatorcontrib><creatorcontrib>Jun, Zou</creatorcontrib><creatorcontrib>Mingming, Shi</creatorcontrib><creatorcontrib>Bobo, Yang</creatorcontrib><creatorcontrib>Yang, Li</creatorcontrib><creatorcontrib>Chunfeng, Guo</creatorcontrib><creatorcontrib>Rongrong, Hu</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>ProQuest Research Library</collection><collection>ProQuest Science Journals</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Xinmeng, Zhai</au><au>Yuefeng, Li</au><au>Jun, Zou</au><au>Mingming, Shi</au><au>Bobo, Yang</au><au>Yang, Li</au><au>Chunfeng, Guo</au><au>Rongrong, Hu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2021-03-01</date><risdate>2021</risdate><volume>50</volume><issue>3</issue><spage>869</spage><epage>880</epage><pages>869-880</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><abstract>This paper investigates the effect of soldering temperature on solder joint voids and reliability of flip-chip LED chips during reflow soldering. Lead-free solder SAC305 was used as solder paste. The void ratio of the flip-chip LED solder joint at 250°C, 260°C, 270°C, 280°C, and 290°C reflow soldering temperatures was detected by x-ray detector. Shear tests were conducted to evaluate the influence of interfacial reactions on the mechanical reliability of solder joints. The distribution of voids in the shear section was observed by scanning electron microscope (SEM). Next, the photoelectric and thermal properties of FC-LED filament were tested and analyzed. Finally, a high-temperature and high-humidity aging experiment was carried out to test the reliability of the LED filament. The results show that the void ratio of the LED filament soldering joint is the lowest when the soldering temperature is 270°C. The small void ratio of the solder joints results in lower steady-state voltage and junction temperature of the flip-chip LED filament. As the void density in the solder joint decreases, the shear strength of the solder joint increases. At this time, the shear resistance and mechanical reliability are the highest.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11664-020-08715-5</doi><tpages>12</tpages><orcidid>https://orcid.org/0000-0002-9548-5957</orcidid></addata></record> |
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| subjects | Characterization and Evaluation of Materials Chemistry and Materials Science Copper Electronics and Microelectronics Emerging Interconnection Technology Flip chip soldering High temperature Instrumentation Interconnect Interface reactions Lead free Materials Science Optical and Electronic Materials Pb-free Solder Photoelectricity Reflow soldering Reliability analysis Shear strength Shear tests Silver Soldered joints Solders Solid State Physics Thermodynamic properties Tin Tin base alloys TMS2020 Advanced Microelectronic Packaging TMS2020 Microelectronic Packaging Void ratio X ray detectors |
| title | Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints |
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