Influence of Additives added to Pd-catalyst Treatment Solutions on Electroless Palladium/Gold Plating on Copper Fine Patterns

To improve the solder joint reliability of Pd/Au layer formed on Cu substrates, the effects of additives added to Pd-catalyst treatment solutions on the solder joint reliability were examined. As additives, ammonia, ethylenediamine-N,N,N',N'-tetraacetic acid dipotassium salt（EDTA･2K）, glyc...

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Veröffentlicht in:	Hyōmen gijutsu 2021/01/01, Vol.72(1), pp.43-49
Hauptverfasser:	TANAKA, Shino, KATO, Tomohito, WATANABE, Hideto, YOSHIDA, Akihiro, GUNJI, Takao, MATSUMOTO, Futoshi
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Additives Ammonia Ammonium molybdate Catalysts Copper Copper Fine Pattern Copper plating Electroless Palladium Plating Electroless plating Ethylenediamine Ethylenediaminetetraacetic acids Glycine Gold Gold plating Palladium Pinhole Pinholes Potassium chromates Reliability analysis Shear strength Solder Joint Reliability Soldered joints Solders Substrates Surface treatment Void
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