Effect of mixing glass frits on electrical property and microstructure of sintered Cu conductive thick film

The resistivity of the sintered Cu thick film decreases with the weight percentage of the SiO2–ZnO–B2O3 additive in the mixing glass frits up to 50 wt%. As the weight percentage of the SiO2–ZnO–B2O3 additive in the mixing glass frits is over 50 wt%, the resistivity of the sintered Cu thick films is...

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Veröffentlicht in:	Journal of the American Ceramic Society 2021-04, Vol.104 (4), p.1707-1715
Hauptverfasser:	Wang, Jyun Yang, Lin, Yi Xuan, Wu, Chen Yu, Chiu, Chung Yu, Lee, Chia Hung, Yeh, Ching Yu, Huang, Bo Rong, Liu, Cheng Yi
Format:	Artikel
Sprache:	eng
Schlagworte:	Additives Boron oxides Composite structures Electrical resistivity Grain boundaries Grain size Microstructure Silicon dioxide Sintering Thick films Twin boundaries Weight Zinc oxide
Online-Zugang:	Volltext
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