Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips
In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder joints was established based on the life data. And vulnerable parts in electronic chips were analyzed. First, th...
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| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2021-01, Vol.11 (1), p.43-50 |
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| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
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| creator | Chen, Yaojun Jing, Bo Li, Jianfeng Jiao, Xiaoxuan Hu, Jiaxing Wang, Yun |
| description | In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder joints was established based on the life data. And vulnerable parts in electronic chips were analyzed. First, the random vibration test was conducted. Second, a lognormal distribution model of solder joints by means of the life data was established and analyzed based on the fracture mechanics theory. Finally, the finite-element simulation model of BGA packaged electronic chip was established and discussed. Failure characteristics of solder joints at different positions in electronic chips were compared and the failure mode of the solder joint was discussed using the simulation result and the observation result with scanning electron microscope (SEM). The results show that the life of each single solder joint in BGA packaged electronic chips follows a logarithmic normal distribution under the random vibration. Solder balls located at the four outermost corners of the chip are subjected to the greatest stress, which are the weakest parts in electronic chips. Cracks in solder joints are generated near the package side and emerged from the edge of the intermetallic compound (IMC) layer with the largest curvature. |
| doi_str_mv | 10.1109/TCPMT.2020.3040757 |
| format | Article |
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A failure model for BGA solder joints was established based on the life data. And vulnerable parts in electronic chips were analyzed. First, the random vibration test was conducted. Second, a lognormal distribution model of solder joints by means of the life data was established and analyzed based on the fracture mechanics theory. Finally, the finite-element simulation model of BGA packaged electronic chip was established and discussed. Failure characteristics of solder joints at different positions in electronic chips were compared and the failure mode of the solder joint was discussed using the simulation result and the observation result with scanning electron microscope (SEM). The results show that the life of each single solder joint in BGA packaged electronic chips follows a logarithmic normal distribution under the random vibration. Solder balls located at the four outermost corners of the chip are subjected to the greatest stress, which are the weakest parts in electronic chips. Cracks in solder joints are generated near the package side and emerged from the edge of the intermetallic compound (IMC) layer with the largest curvature.</description><identifier>ISSN: 2156-3950</identifier><identifier>EISSN: 2156-3985</identifier><identifier>DOI: 10.1109/TCPMT.2020.3040757</identifier><identifier>CODEN: ITCPC8</identifier><language>eng</language><publisher>Piscataway: IEEE</publisher><subject>Degradation ; Electronic equipment ; Failure analysis ; Failure characteristics ; Failure modes ; Finite element analysis ; Finite element method ; Fracture mechanics ; Intermetallic compounds ; life distribution ; Normal distribution ; Random vibration ; Reliability ; Simulation ; solder joints ; Soldered joints ; Soldering ; Solders ; Strain ; Tin base alloys ; Vibration analysis ; Vibration tests ; Vibrations</subject><ispartof>IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-01, Vol.11 (1), p.43-50</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2021</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c361t-1f1eb2a021565193a62da8073182b6836d9f5c349dfa817b621c59a204a4f7ea3</citedby><cites>FETCH-LOGICAL-c361t-1f1eb2a021565193a62da8073182b6836d9f5c349dfa817b621c59a204a4f7ea3</cites><orcidid>0000-0003-1530-1319 ; 0000-0001-8647-0115 ; 0000-0002-3914-9684 ; 0000-0002-2474-8692</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/9272309$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/9272309$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Chen, Yaojun</creatorcontrib><creatorcontrib>Jing, Bo</creatorcontrib><creatorcontrib>Li, Jianfeng</creatorcontrib><creatorcontrib>Jiao, Xiaoxuan</creatorcontrib><creatorcontrib>Hu, Jiaxing</creatorcontrib><creatorcontrib>Wang, Yun</creatorcontrib><title>Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder joints was established based on the life data. And vulnerable parts in electronic chips were analyzed. First, the random vibration test was conducted. Second, a lognormal distribution model of solder joints by means of the life data was established and analyzed based on the fracture mechanics theory. Finally, the finite-element simulation model of BGA packaged electronic chip was established and discussed. Failure characteristics of solder joints at different positions in electronic chips were compared and the failure mode of the solder joint was discussed using the simulation result and the observation result with scanning electron microscope (SEM). The results show that the life of each single solder joint in BGA packaged electronic chips follows a logarithmic normal distribution under the random vibration. Solder balls located at the four outermost corners of the chip are subjected to the greatest stress, which are the weakest parts in electronic chips. Cracks in solder joints are generated near the package side and emerged from the edge of the intermetallic compound (IMC) layer with the largest curvature.</description><subject>Degradation</subject><subject>Electronic equipment</subject><subject>Failure analysis</subject><subject>Failure characteristics</subject><subject>Failure modes</subject><subject>Finite element analysis</subject><subject>Finite element method</subject><subject>Fracture mechanics</subject><subject>Intermetallic compounds</subject><subject>life distribution</subject><subject>Normal distribution</subject><subject>Random vibration</subject><subject>Reliability</subject><subject>Simulation</subject><subject>solder joints</subject><subject>Soldered joints</subject><subject>Soldering</subject><subject>Solders</subject><subject>Strain</subject><subject>Tin base alloys</subject><subject>Vibration analysis</subject><subject>Vibration tests</subject><subject>Vibrations</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kE9PAjEQxRujiQT5Anpp4nlx2m632yNu-KOBQCKem7LbYnHdYrsc-PYuQpjLzOG9yXs_hB4JDAkB-bIuVov1kAKFIYMUBBc3qEcJzxImc357vTnco0GMO-iG5yCA9dByol19CAaPGl0fo4tYNxVe-MrUrtlib_GHrysT8Lt3TRuxa_DrdIRXuvzWW1PhcW3KNvjGlbj4cvv4gO6srqMZXHYffU7G62KWzJfTt2I0T0qWkTYhlpgN1XBKxolkOqOV7iIxktNNlrOskpaXLJWV1TkRm4ySkktNIdWpFUazPno-_90H_3swsVU7fwhdh6homjOaAheyU9Gzqgw-xmCs2gf3o8NREVAnduqfnTqxUxd2nenpbHLGmKtBUkEZSPYHp81oYA</recordid><startdate>202101</startdate><enddate>202101</enddate><creator>Chen, Yaojun</creator><creator>Jing, Bo</creator><creator>Li, Jianfeng</creator><creator>Jiao, Xiaoxuan</creator><creator>Hu, Jiaxing</creator><creator>Wang, Yun</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0003-1530-1319</orcidid><orcidid>https://orcid.org/0000-0001-8647-0115</orcidid><orcidid>https://orcid.org/0000-0002-3914-9684</orcidid><orcidid>https://orcid.org/0000-0002-2474-8692</orcidid></search><sort><creationdate>202101</creationdate><title>Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips</title><author>Chen, Yaojun ; Jing, Bo ; Li, Jianfeng ; Jiao, Xiaoxuan ; Hu, Jiaxing ; Wang, Yun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c361t-1f1eb2a021565193a62da8073182b6836d9f5c349dfa817b621c59a204a4f7ea3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Degradation</topic><topic>Electronic equipment</topic><topic>Failure analysis</topic><topic>Failure characteristics</topic><topic>Failure modes</topic><topic>Finite element analysis</topic><topic>Finite element method</topic><topic>Fracture mechanics</topic><topic>Intermetallic compounds</topic><topic>life distribution</topic><topic>Normal distribution</topic><topic>Random vibration</topic><topic>Reliability</topic><topic>Simulation</topic><topic>solder joints</topic><topic>Soldered joints</topic><topic>Soldering</topic><topic>Solders</topic><topic>Strain</topic><topic>Tin base alloys</topic><topic>Vibration analysis</topic><topic>Vibration tests</topic><topic>Vibrations</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, Yaojun</creatorcontrib><creatorcontrib>Jing, Bo</creatorcontrib><creatorcontrib>Li, Jianfeng</creatorcontrib><creatorcontrib>Jiao, Xiaoxuan</creatorcontrib><creatorcontrib>Hu, Jiaxing</creatorcontrib><creatorcontrib>Wang, Yun</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chen, Yaojun</au><au>Jing, Bo</au><au>Li, Jianfeng</au><au>Jiao, Xiaoxuan</au><au>Hu, Jiaxing</au><au>Wang, Yun</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips</atitle><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle><stitle>TCPMT</stitle><date>2021-01</date><risdate>2021</risdate><volume>11</volume><issue>1</issue><spage>43</spage><epage>50</epage><pages>43-50</pages><issn>2156-3950</issn><eissn>2156-3985</eissn><coden>ITCPC8</coden><abstract>In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder joints was established based on the life data. And vulnerable parts in electronic chips were analyzed. First, the random vibration test was conducted. Second, a lognormal distribution model of solder joints by means of the life data was established and analyzed based on the fracture mechanics theory. Finally, the finite-element simulation model of BGA packaged electronic chip was established and discussed. Failure characteristics of solder joints at different positions in electronic chips were compared and the failure mode of the solder joint was discussed using the simulation result and the observation result with scanning electron microscope (SEM). The results show that the life of each single solder joint in BGA packaged electronic chips follows a logarithmic normal distribution under the random vibration. Solder balls located at the four outermost corners of the chip are subjected to the greatest stress, which are the weakest parts in electronic chips. Cracks in solder joints are generated near the package side and emerged from the edge of the intermetallic compound (IMC) layer with the largest curvature.</abstract><cop>Piscataway</cop><pub>IEEE</pub><doi>10.1109/TCPMT.2020.3040757</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0003-1530-1319</orcidid><orcidid>https://orcid.org/0000-0001-8647-0115</orcidid><orcidid>https://orcid.org/0000-0002-3914-9684</orcidid><orcidid>https://orcid.org/0000-0002-2474-8692</orcidid></addata></record> |
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| subjects | Degradation Electronic equipment Failure analysis Failure characteristics Failure modes Finite element analysis Finite element method Fracture mechanics Intermetallic compounds life distribution Normal distribution Random vibration Reliability Simulation solder joints Soldered joints Soldering Solders Strain Tin base alloys Vibration analysis Vibration tests Vibrations |
| title | Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips |
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