Thermomechanical Strength of Element Connections in Microelectronic Modules

The design and technology of solder and adhesive bonds, as well as the elastic strength and plastic properties of the materials of a Si crystal, solder, and glue joint, are the most significant factors characterizing the reliability and durability of a microelectronic module. The structure proposed...

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Veröffentlicht in:	Russian microelectronics 2020-12, Vol.49 (7), p.489-493
Hauptverfasser:	Pogalov, A. I., Titov, A. Yu, Timoshenkov, S. P.
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive bonding Bismuth Bonding strength Conductors Copper Durability Elastic properties Electrical Engineering Engineering High temperature Microelectronics Modules Plastic properties Reliability aspects Silicon Solders Stresses Weight reduction
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