Investigation of microstructure and wetting behavior of Sn–3.0Ag–0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate

The current investigation was conducted to understand the effect of 1wt. % silicon carbide (SiC) in the Sn–3.5Ag–0.5Cu (SAC305) lead-free solder alloy which was produced by the powder metallurgy method. A systematic investigation of the microstructure of the solidified composite solder along with it...

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Veröffentlicht in:	Intermetallics 2021-01, Vol.128, p.106991, Article 106991
Hauptverfasser:	Pal, Manoj Kumar, Gergely, Gréta, Koncz-Horváth, Dániel, Gácsi, Zoltán
Format:	Artikel
Sprache:	eng
Schlagworte:	Contact angle Copper Cracks Ductile-brittle transition Free energy Lead free Lead–free solder Metallurgical analysis Microcracks Microstructure Nucleation Powder metallurgy RA (Rosin activated) flux Silicon carbide Solders Spread factor Spread ratio Substrates Thickness Tin Tin base alloys Wetting
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