On coupling contact analysis of thermoelectric materials

•Coupling contact model is established for thermoelectric materials.•Full-field analytical solutions in electric and temperature fields are derived.•Thermoelastic governing equations subjected to equivalent external loadings are solved.•Useful evaluation formulas are given for measuring the thermoel...

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Veröffentlicht in:	Applied Mathematical Modelling 2021-01, Vol.89, p.1459-1474
Hauptverfasser:	Zhou, Y.T., Tian, X.J., Li, F.J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Closed-form solution Contact stresses Cooling Coupling Electric contacts Hardness tests Indentation Intensity factors Punch Seebeck effect Stress intensity factors Surface contact stress Thermoelectric materials
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