Book Reviews
When a material undergoes a phase change such as a solid turning into a liquid, generally energy is absorbed by the material in order to change from a solid to a liquid. This energy absorption, at the phase change point, can be utilized to enhance a heat sink capacity during transient events to cont...
Gespeichert in:
| Veröffentlicht in: | IEEE electrical insulation magazine 2021, Vol.37 (1), p.43 |
|---|---|
| Hauptverfasser: | , , , , , , , , , , , , , , |
| Format: | Review |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | 1 |
| container_start_page | 43 |
| container_title | IEEE electrical insulation magazine |
| container_volume | 37 |
| creator | Shea, John J Rangarajan, S Balaji, C Werneck, M M Allil, R Brener, I Liu, S Staude, I Valentine, J Holloway, C Peelo, D F Arora, R Rajpurohit, B S Bensky, A Lednor, P W |
| description | When a material undergoes a phase change such as a solid turning into a liquid, generally energy is absorbed by the material in order to change from a solid to a liquid. This energy absorption, at the phase change point, can be utilized to enhance a heat sink capacity during transient events to control the temperature rise in an electronic component. Phase-change materials (PCM) can be incorporated into a heatsink to provide the additional energy absorption and heat dissipation during these transient thermal events in electronic components to allow for great operating range. |
| doi_str_mv | 10.1109/MEI.2021.9290464 |
| format | Review |
| fullrecord | <record><control><sourceid>proquest</sourceid><recordid>TN_cdi_proquest_journals_2469476432</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2469476432</sourcerecordid><originalsourceid>FETCH-proquest_journals_24694764323</originalsourceid><addsrcrecordid>eNpjYJAwNNAzNDSw1Pd19dQzMjAy1LM0sjQwMTNhYuA0NDW10DUxMTBiYeA0sLAw1jU3NTXhYOAqLs4yMDAwMbA05mTgccrPz1YISi3LTC0v5mFgTUvMKU7lhdLcDMpuriHOHroFRfmFpanFJfFZ-aVFeUCpeCMTM0sTczMTYyNj4lQBAOulK9M</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>review</recordtype><pqid>2469476432</pqid></control><display><type>review</type><title>Book Reviews</title><source>IEEE Electronic Library (IEL)</source><creator>Shea, John J ; Rangarajan, S ; Balaji, C ; Werneck, M M ; Allil, R ; Brener, I ; Liu, S ; Staude, I ; Valentine, J ; Holloway, C ; Peelo, D F ; Arora, R ; Rajpurohit, B S ; Bensky, A ; Lednor, P W</creator><creatorcontrib>Shea, John J ; Rangarajan, S ; Balaji, C ; Werneck, M M ; Allil, R ; Brener, I ; Liu, S ; Staude, I ; Valentine, J ; Holloway, C ; Peelo, D F ; Arora, R ; Rajpurohit, B S ; Bensky, A ; Lednor, P W</creatorcontrib><description>When a material undergoes a phase change such as a solid turning into a liquid, generally energy is absorbed by the material in order to change from a solid to a liquid. This energy absorption, at the phase change point, can be utilized to enhance a heat sink capacity during transient events to control the temperature rise in an electronic component. Phase-change materials (PCM) can be incorporated into a heatsink to provide the additional energy absorption and heat dissipation during these transient thermal events in electronic components to allow for great operating range.</description><identifier>ISSN: 0883-7554</identifier><identifier>EISSN: 1558-4402</identifier><identifier>DOI: 10.1109/MEI.2021.9290464</identifier><language>eng</language><publisher>New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</publisher><subject>Electronic components ; Energy absorption ; Heat sinks ; Phase change materials</subject><ispartof>IEEE electrical insulation magazine, 2021, Vol.37 (1), p.43</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2021</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>313,776,780,788,27899,27902</link.rule.ids></links><search><creatorcontrib>Shea, John J</creatorcontrib><creatorcontrib>Rangarajan, S</creatorcontrib><creatorcontrib>Balaji, C</creatorcontrib><creatorcontrib>Werneck, M M</creatorcontrib><creatorcontrib>Allil, R</creatorcontrib><creatorcontrib>Brener, I</creatorcontrib><creatorcontrib>Liu, S</creatorcontrib><creatorcontrib>Staude, I</creatorcontrib><creatorcontrib>Valentine, J</creatorcontrib><creatorcontrib>Holloway, C</creatorcontrib><creatorcontrib>Peelo, D F</creatorcontrib><creatorcontrib>Arora, R</creatorcontrib><creatorcontrib>Rajpurohit, B S</creatorcontrib><creatorcontrib>Bensky, A</creatorcontrib><creatorcontrib>Lednor, P W</creatorcontrib><title>Book Reviews</title><title>IEEE electrical insulation magazine</title><description>When a material undergoes a phase change such as a solid turning into a liquid, generally energy is absorbed by the material in order to change from a solid to a liquid. This energy absorption, at the phase change point, can be utilized to enhance a heat sink capacity during transient events to control the temperature rise in an electronic component. Phase-change materials (PCM) can be incorporated into a heatsink to provide the additional energy absorption and heat dissipation during these transient thermal events in electronic components to allow for great operating range.</description><subject>Electronic components</subject><subject>Energy absorption</subject><subject>Heat sinks</subject><subject>Phase change materials</subject><issn>0883-7554</issn><issn>1558-4402</issn><fulltext>true</fulltext><rsrctype>review</rsrctype><creationdate>2021</creationdate><recordtype>review</recordtype><sourceid/><recordid>eNpjYJAwNNAzNDSw1Pd19dQzMjAy1LM0sjQwMTNhYuA0NDW10DUxMTBiYeA0sLAw1jU3NTXhYOAqLs4yMDAwMbA05mTgccrPz1YISi3LTC0v5mFgTUvMKU7lhdLcDMpuriHOHroFRfmFpanFJfFZ-aVFeUCpeCMTM0sTczMTYyNj4lQBAOulK9M</recordid><startdate>20210101</startdate><enddate>20210101</enddate><creator>Shea, John J</creator><creator>Rangarajan, S</creator><creator>Balaji, C</creator><creator>Werneck, M M</creator><creator>Allil, R</creator><creator>Brener, I</creator><creator>Liu, S</creator><creator>Staude, I</creator><creator>Valentine, J</creator><creator>Holloway, C</creator><creator>Peelo, D F</creator><creator>Arora, R</creator><creator>Rajpurohit, B S</creator><creator>Bensky, A</creator><creator>Lednor, P W</creator><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope/></search><sort><creationdate>20210101</creationdate><title>Book Reviews</title><author>Shea, John J ; Rangarajan, S ; Balaji, C ; Werneck, M M ; Allil, R ; Brener, I ; Liu, S ; Staude, I ; Valentine, J ; Holloway, C ; Peelo, D F ; Arora, R ; Rajpurohit, B S ; Bensky, A ; Lednor, P W</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-proquest_journals_24694764323</frbrgroupid><rsrctype>reviews</rsrctype><prefilter>reviews</prefilter><language>eng</language><creationdate>2021</creationdate><topic>Electronic components</topic><topic>Energy absorption</topic><topic>Heat sinks</topic><topic>Phase change materials</topic><toplevel>online_resources</toplevel><creatorcontrib>Shea, John J</creatorcontrib><creatorcontrib>Rangarajan, S</creatorcontrib><creatorcontrib>Balaji, C</creatorcontrib><creatorcontrib>Werneck, M M</creatorcontrib><creatorcontrib>Allil, R</creatorcontrib><creatorcontrib>Brener, I</creatorcontrib><creatorcontrib>Liu, S</creatorcontrib><creatorcontrib>Staude, I</creatorcontrib><creatorcontrib>Valentine, J</creatorcontrib><creatorcontrib>Holloway, C</creatorcontrib><creatorcontrib>Peelo, D F</creatorcontrib><creatorcontrib>Arora, R</creatorcontrib><creatorcontrib>Rajpurohit, B S</creatorcontrib><creatorcontrib>Bensky, A</creatorcontrib><creatorcontrib>Lednor, P W</creatorcontrib></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Shea, John J</au><au>Rangarajan, S</au><au>Balaji, C</au><au>Werneck, M M</au><au>Allil, R</au><au>Brener, I</au><au>Liu, S</au><au>Staude, I</au><au>Valentine, J</au><au>Holloway, C</au><au>Peelo, D F</au><au>Arora, R</au><au>Rajpurohit, B S</au><au>Bensky, A</au><au>Lednor, P W</au><format>journal</format><genre>article</genre><ristype>GEN</ristype><atitle>Book Reviews</atitle><jtitle>IEEE electrical insulation magazine</jtitle><date>2021-01-01</date><risdate>2021</risdate><volume>37</volume><issue>1</issue><spage>43</spage><pages>43-</pages><issn>0883-7554</issn><eissn>1558-4402</eissn><abstract>When a material undergoes a phase change such as a solid turning into a liquid, generally energy is absorbed by the material in order to change from a solid to a liquid. This energy absorption, at the phase change point, can be utilized to enhance a heat sink capacity during transient events to control the temperature rise in an electronic component. Phase-change materials (PCM) can be incorporated into a heatsink to provide the additional energy absorption and heat dissipation during these transient thermal events in electronic components to allow for great operating range.</abstract><cop>New York</cop><pub>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</pub><doi>10.1109/MEI.2021.9290464</doi></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0883-7554 |
| ispartof | IEEE electrical insulation magazine, 2021, Vol.37 (1), p.43 |
| issn | 0883-7554 1558-4402 |
| language | eng |
| recordid | cdi_proquest_journals_2469476432 |
| source | IEEE Electronic Library (IEL) |
| subjects | Electronic components Energy absorption Heat sinks Phase change materials |
| title | Book Reviews |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T05%3A12%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Book%20Reviews&rft.jtitle=IEEE%20electrical%20insulation%20magazine&rft.au=Shea,%20John%20J&rft.date=2021-01-01&rft.volume=37&rft.issue=1&rft.spage=43&rft.pages=43-&rft.issn=0883-7554&rft.eissn=1558-4402&rft_id=info:doi/10.1109/MEI.2021.9290464&rft_dat=%3Cproquest%3E2469476432%3C/proquest%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2469476432&rft_id=info:pmid/&rfr_iscdi=true |