Special Issue on Advanced Abrasive Process Technologies

The demand for high-precision and high-efficiency machining of hard ceramics such as silicon carbide (SiC) for semiconductors and hardened steel for molding dies has significantly increased for power devices in automobiles, optical devices, and medical devices. Certain types of hard metals can be ma...

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Veröffentlicht in:	International journal of automation technology 2019-11, Vol.13 (6), p.721-721
Hauptverfasser:	Suzuki, Hirofumi, Ohashi, Kazuhito
Format:	Artikel
Sprache:	eng
Schlagworte:	Abrasive machining Abrasive processes Abrasives Brittle materials Brittleness Cemented carbides Ceramic molding materials Ceramics Diamond machining Die steels Dies Electronic devices Grinding Hard materials Machine tools Medical equipment Polishing Scientific papers Semiconductor materials Silicon carbide Surface properties Ultrasonic vibration Ultraviolet lasers
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